罗斌森
  • QEB363YR

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Discontinued at Digi-Key
    Type : Infrared (IR)
    Current - DC Forward (If) (Max) : 50mA
    Radiant Intensity (Ie) Min @ If : 8mW/sr @ 100mA
    Wavelength : 940nm
    Voltage - Forward (Vf) (Typ) : 1.6V (Max)
    Viewing Angle : 24°
    Orientation : Top View
    Operating Temperature : -40°C ~ 100°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 2-SMD, Yoke Bend

极速报价

型号
品牌 封装 批号 查看
MBRS3100PT3G ON SMC New 详细
2SB1216S-E ON TP New 详细
AR0522SRSC09SURAH3-GEVB ON New 详细
ATP101-TL-HX ON ATPAK New 详细
MC10ELT20DT ON 8-TSSOP New 详细
FSA805UMX ON 12-UMLP (1.8x1.8) New 详细
NTD4854NT4G ON DPAK New 详细
MC78L08ACP ON TO-92-3 New 详细
LM311MX ON 8-SOP New 详细
74LVX138SJ ON 16-SOP New 详细
MM5Z27VT1G ON SOD-523 New 详细
UC3843BD1 ON 8-SOIC New 详细
NCP1070STAT3G ON SOT-223 (TO-261) New 详细
74LVTH2244MTC ON 20-TSSOP New 详细
OPB862T55 ON New 详细
NDS9953A ON 8-SOIC New 详细
SS8050CBU ON TO-92-3 New 详细
FAN1582MX ON TO-263-5 New 详细
SBS822-TL-W ON 5-MCPH New 详细
LV5803M-TE-L-E ON 8-MFP New 详细