罗斌森
  • QEE113E3R0

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Type : Infrared (IR)
    Current - DC Forward (If) (Max) : 50mA
    Radiant Intensity (Ie) Min @ If : 3mW/sr @ 100mA
    Wavelength : 940nm
    Voltage - Forward (Vf) (Typ) : 1.5V
    Viewing Angle : 50°
    Orientation : Side View
    Operating Temperature : -40°C ~ 100°C (TA)
    Mounting Type : Through Hole
    Package / Case : Radial, Side View

极速报价

型号
品牌 封装 批号 查看
1N4004RLG ON DO-41 New 详细
MBRB4030T4G ON D2PAK New 详细
NCV33064P-5RAG ON TO-92-3 New 详细
NVMFS5C670NLWFAFT1G ON 5-DFN (5x6) (8-SOFL) New 详细
MOC3052TVM ON 6-DIP New 详细
MC10H104PG ON 16-DIP New 详细
MMSZ4698T1 ON SOD-123 New 详细
NCV8570MN180R2G ON 6-DFN (2x2.2) New 详细
SCY99192BFCT260T2G ON New 详细
SZMM3Z15VT1G ON SOD-323 New 详细
2N5400G ON TO-92-3 New 详细
MV64538MP8B ON New 详细
NC7ST32L6X ON 6-MicroPak New 详细
MMBD717LT1G ON SC-70-3 (SOT323) New 详细
74ACT151SC ON 16-SOIC New 详细
74VHC175SJ ON New 详细
HCPL0452V ON 8-SOIC New 详细
RHRP860-F102 ON TO-220-2 New 详细
MC100EP116FAR2 ON 32-LQFP (7x7) New 详细
LM2575D2T-012G ON D2PAK-5 New 详细