产品系列
产品系列
0804MC
- Manufacturer : Texas Instruments
Packaging : Tray
Part Status : Active
Type : Transistor, TO-3
Number of Positions or Pins (Grid) : 8 (Oval)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0μin (0.76μm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0μin (5.08μm)
Contact Material - Post : Brass
Housing Material : Polyester, Glass Filled
Operating Temperature : -55°C ~ 150°C
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LM3489QMMX/NOPB | TI | 8-VSSOP | New | 详细 | |
| LM60BIM3X | TI | SOT-23-3 | New | 详细 | |
| SN74HC244NG4 | TI | 20-PDIP | New | 详细 | |
| LP8345IDTX-3.3/NOPB | TI | TO-252-3 | New | 详细 | |
| LM2937ES-2.5 | TI | DDPAK/TO-263-3 | New | 详细 | |
| CC2595RGTT | TI | 16-QFN (3x3) | New | 详细 | |
| BOOSTXL-CAPKEYPAD | TI | New | 详细 | ||
| LMP2232BMA/NOPB | TI | 8-SOIC | New | 详细 | |
| CDC5801DBQG4 | TI | 24-SSOP/QSOP | New | 详细 | |
| TL2845DR | TI | 14-SOIC | New | 详细 | |
| CD74HCT08MT | TI | 14-SOIC | New | 详细 | |
| OMAPL138EZCED4 | TI | 361-NFBGA (13x13) | New | 详细 | |
| TLV4316QPWRQ1 | TI | 14-TSSOP | New | 详细 | |
| LM3S9BN6-IBZ80-C3T | TI | 108-BGA (10x10) | New | 详细 | |
| TXS4558EVM | TI | New | 详细 | ||
| TPD1E04U04EVM | TI | New | 详细 | ||
| THS4022CDRG4 | TI | 8-SOIC | New | 详细 | |
| LP2989ILD-2.8 | TI | 8-WSON (4x4) | New | 详细 | |
| SN74BCT2240DWRG4 | TI | 20-SOIC | New | 详细 | |
| SN74ABT7819A-10PN | TI | 80-LQFP (12x12) | New | 详细 |
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