产品系列
产品系列
0804MC
- Manufacturer : Texas Instruments
Packaging : Tray
Part Status : Active
Type : Transistor, TO-3
Number of Positions or Pins (Grid) : 8 (Oval)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0μin (0.76μm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0μin (5.08μm)
Contact Material - Post : Brass
Housing Material : Polyester, Glass Filled
Operating Temperature : -55°C ~ 150°C
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TMS320DM8169BCYG4 | TI | New | 详细 | ||
| LM358AMX/NOPB | TI | 8-SOIC | New | 详细 | |
| LM4051CIM3X-1.2/NOPB | TI | SOT-23-3 | New | 详细 | |
| LM4140BCM-1.2/NOPB | TI | 8-SOIC | New | 详细 | |
| SN74AS86ADR | TI | 14-SOIC | New | 详细 | |
| TLV1570IPW | TI | 20-TSSOP | New | 详细 | |
| TPSM84A21EVM-808 | TI | New | 详细 | ||
| TLV2254AIN | TI | 14-PDIP | New | 详细 | |
| TPA6211A1DRBR | TI | 8-SON (3x3) | New | 详细 | |
| CSD18541F5 | TI | 3-PICOSTAR | New | 详细 | |
| LP5907QMFX-3.8Q1 | TI | SOT-23-5 | New | 详细 | |
| SN74ABT162501DGGR | TI | 56-TSSOP | New | 详细 | |
| LMR16006YQ5DDCRQ1 | TI | TSOT-23-6 | New | 详细 | |
| TRSF3222EIDB | TI | 20-SSOP | New | 详细 | |
| PMS430E325AFZ | TI | 68-JLCC (23.94x23.94) | New | 详细 | |
| SN74LV374ATPWE4 | TI | New | 详细 | ||
| PT6656P | TI | New | 详细 | ||
| SN10501DGK | TI | 8-VSSOP | New | 详细 | |
| SN74BCT29827BDWR | TI | 24-SOIC | New | 详细 | |
| ONET1151PRGTT | TI | 16-QFN (3x3) | New | 详细 |
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