罗斌森
  • 0804MC

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Part Status : Active
    Type : Transistor, TO-3
    Number of Positions or Pins (Grid) : 8 (Oval)
    Contact Finish - Mating : Gold
    Contact Finish Thickness - Mating : 30.0μin (0.76μm)
    Contact Material - Mating : Beryllium Copper
    Mounting Type : Through Hole
    Features : Closed Frame
    Termination : Solder
    Contact Finish - Post : Tin
    Contact Finish Thickness - Post : 200.0μin (5.08μm)
    Contact Material - Post : Brass
    Housing Material : Polyester, Glass Filled
    Operating Temperature : -55°C ~ 150°C

极速报价

型号
品牌 封装 批号 查看
LP2986AIM-3.3 TI 8-SOIC New 详细
TLC556CD TI 14-SOIC New 详细
INA211CQDCKRQ1 TI SC-70-6 New 详细
OPA2320AIDGKT TI 8-VSSOP New 详细
PTN78020HAZT TI New 详细
SN74LS174DR TI New 详细
TPS3808G125QDBVRQ1 TI SOT-23-6 New 详细
LP2989IMX-3.3/NOPB TI 8-SOIC New 详细
LM5175PWPR TI 28-HTSSOP New 详细
TMS320F280220PTS TI 48-LQFP (7x7) New 详细
DRV8301-RM48-KIT TI New 详细
TMS320VC5510AZGWA1 TI 240-BGA MicroStar (15x15) New 详细
SN74ALS867ADW TI 24-SOIC New 详细
TLV4172IDR TI 14-SOIC New 详细
TLC555CPSR TI 8-SO New 详细
SN74ABT657ANSRG4 TI 24-SO New 详细
TPS7A0515PDBVR TI SOT-23-5 New 详细
TLV3491AIDBVT TI SOT-23-5 New 详细
LM5007SD TI 8-WSON (4x4) New 详细
LM3S6C11-IQC80-A2T TI 100-LQFP (14x14) New 详细