产品系列
产品系列
0804MC
- Manufacturer : Texas Instruments
Packaging : Tray
Part Status : Active
Type : Transistor, TO-3
Number of Positions or Pins (Grid) : 8 (Oval)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0μin (0.76μm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0μin (5.08μm)
Contact Material - Post : Brass
Housing Material : Polyester, Glass Filled
Operating Temperature : -55°C ~ 150°C
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| CD4082BE | TI | 14-PDIP | New | 详细 | |
| LM5008SDX/NOPB | TI | 8-WSON (4x4) | New | 详细 | |
| CY74FCT2244TQCT | TI | 20-SSOP/QSOP | New | 详细 | |
| SN74AHCT374N | TI | New | 详细 | ||
| RI-TRP-W9WK-03 | TI | New | 详细 | ||
| SN74ABT16501DLR | TI | 56-SSOP | New | 详细 | |
| LM5008SDC/NOPB | TI | 8-WSON (4x4) | New | 详细 | |
| OPA2613IDTJRG3 | TI | 8-HSOP | New | 详细 | |
| SN74LVC1G386DCKR | TI | SC-70-6 | New | 详细 | |
| DDC264CZAW | TI | 100-NFBGA (9x9) | New | 详细 | |
| OPA4316QPWRQ1 | TI | 14-TSSOP | New | 详细 | |
| RI-TRP-R9QL-30 | TI | New | 详细 | ||
| LM22675QMR-5.0/NOPB | TI | 8-SO PowerPad | New | 详细 | |
| TS3A226EYFFR | TI | 9-DSBGA (1.2x1.3) | New | 详细 | |
| SN74ALVCH16334DGGR | TI | 48-TSSOP | New | 详细 | |
| BQ29705DSER | TI | 6-WSON (1.5x1.5) | New | 详细 | |
| TPS650860A0RSKT | TI | 64-VQFN (8x8) | New | 详细 | |
| TPS54201DDCR | TI | TSOT-23-6 | New | 详细 | |
| MAX3232ECD | TI | 16-SOIC | New | 详细 | |
| LMK61E0-156M25SIAT | TI | 6-QFM (7x5) | New | 详细 |
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