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  • 0804MC

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Part Status : Active
    Type : Transistor, TO-3
    Number of Positions or Pins (Grid) : 8 (Oval)
    Contact Finish - Mating : Gold
    Contact Finish Thickness - Mating : 30.0μin (0.76μm)
    Contact Material - Mating : Beryllium Copper
    Mounting Type : Through Hole
    Features : Closed Frame
    Termination : Solder
    Contact Finish - Post : Tin
    Contact Finish Thickness - Post : 200.0μin (5.08μm)
    Contact Material - Post : Brass
    Housing Material : Polyester, Glass Filled
    Operating Temperature : -55°C ~ 150°C

极速报价

型号
品牌 封装 批号 查看
LP2992AIM5X-5.0/NOPB TI SOT-23-5 New 详细
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LP2980IBP-3.3/NOPB TI 5-μSMD (0.93x1.11) New 详细
DAC5311IDCKT TI SC-70-6 New 详细
ULN2003V12DR TI 16-SOIC New 详细
LM2439T/NOPB TI TO-220-9 New 详细
LP2985AIBPX-5.0/NOPB TI 5-μSMD (0.93x1.11) New 详细
TLV2473IDR TI 14-SOIC New 详细
CSD13306W TI 6-DSBGA (1x1.5) New 详细
REF102BP TI 8-PDIP New 详细
UCD7232RTJR TI 20-QFN (4x4) New 详细
TLC272ACP TI 8-PDIP New 详细
CD74HC4518E TI 16-PDIP New 详细
SN74AHC123AN TI 16-PDIP New 详细
OPA2342UA TI 8-SOIC New 详细
CSD18536KCS TI TO-220-3 New 详细
SN74AUC2G02YEPR TI 8-DSBGA, 8-WCSP (1.9x0.9) New 详细
DAC8832ICRGYT TI 14-VQFN (3.5x3.5) New 详细
BQ24125RHLR TI 20-VQFN (3.5x4.5) New 详细
TLV2463AID TI 14-SOIC New 详细