产品系列
产品系列
0804MC
- Manufacturer : Texas Instruments
Packaging : Tray
Part Status : Active
Type : Transistor, TO-3
Number of Positions or Pins (Grid) : 8 (Oval)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0μin (0.76μm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0μin (5.08μm)
Contact Material - Post : Brass
Housing Material : Polyester, Glass Filled
Operating Temperature : -55°C ~ 150°C
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| DS90UB925QSQ/NOPB | TI | 48-WQFN (7x7) | New | 详细 | |
| SG3524NSR | TI | 16-SO | New | 详细 | |
| UC3903Q | TI | 20-PLCC (9x9) | New | 详细 | |
| LM1972N | TI | 20-DIP | New | 详细 | |
| LM2902KAVQDRG4 | TI | 14-SOIC | New | 详细 | |
| SN65HVD230DR | TI | 8-SOIC | New | 详细 | |
| LM3525MX-L | TI | 8-SOIC | New | 详细 | |
| LM3622AM-8.2/NOPB | TI | 8-SOIC | New | 详细 | |
| SN65LV1023DB | TI | 28-SSOP | New | 详细 | |
| TPD4E02B04DQAR | TI | 10-USON (2.5x1) | New | 详细 | |
| LM3S5D51-IBZ80-A2 | TI | 108-BGA (10x10) | New | 详细 | |
| OPA1S2384EVM | TI | New | 详细 | ||
| TL071BCDR | TI | 8-SOIC | New | 详细 | |
| UC2625Q | TI | 28-PLCC (11.51x11.51) | New | 详细 | |
| SN74SSTVF16857VR | TI | 48-TVSOP | New | 详细 | |
| LM3S1C26-IQR80-A1T | TI | 64-LQFP (10x10) | New | 详细 | |
| LM35AH | TI | TO-46-3 | New | 详细 | |
| LM35CH/NOPB | TI | TO-46-3 | New | 详细 | |
| LM4040CIM3-5.0 | TI | SOT-23-3 | New | 详细 | |
| TPS2069CDBVR | TI | SOT-23-5 | New | 详细 |
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