产品系列
产品系列
0804MC
- Manufacturer : Texas Instruments
Packaging : Tray
Part Status : Active
Type : Transistor, TO-3
Number of Positions or Pins (Grid) : 8 (Oval)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0μin (0.76μm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0μin (5.08μm)
Contact Material - Post : Brass
Housing Material : Polyester, Glass Filled
Operating Temperature : -55°C ~ 150°C
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LP2992AIM5X-5.0/NOPB | TI | SOT-23-5 | New | 详细 | |
| RC4558IDGKR | TI | 8-VSSOP | New | 详细 | |
| LP2980IBP-3.3/NOPB | TI | 5-μSMD (0.93x1.11) | New | 详细 | |
| DAC5311IDCKT | TI | SC-70-6 | New | 详细 | |
| ULN2003V12DR | TI | 16-SOIC | New | 详细 | |
| LM2439T/NOPB | TI | TO-220-9 | New | 详细 | |
| LP2985AIBPX-5.0/NOPB | TI | 5-μSMD (0.93x1.11) | New | 详细 | |
| TLV2473IDR | TI | 14-SOIC | New | 详细 | |
| CSD13306W | TI | 6-DSBGA (1x1.5) | New | 详细 | |
| REF102BP | TI | 8-PDIP | New | 详细 | |
| UCD7232RTJR | TI | 20-QFN (4x4) | New | 详细 | |
| TLC272ACP | TI | 8-PDIP | New | 详细 | |
| CD74HC4518E | TI | 16-PDIP | New | 详细 | |
| SN74AHC123AN | TI | 16-PDIP | New | 详细 | |
| OPA2342UA | TI | 8-SOIC | New | 详细 | |
| CSD18536KCS | TI | TO-220-3 | New | 详细 | |
| SN74AUC2G02YEPR | TI | 8-DSBGA, 8-WCSP (1.9x0.9) | New | 详细 | |
| DAC8832ICRGYT | TI | 14-VQFN (3.5x3.5) | New | 详细 | |
| BQ24125RHLR | TI | 20-VQFN (3.5x4.5) | New | 详细 | |
| TLV2463AID | TI | 14-SOIC | New | 详细 |
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