罗斌森
  • 551600153-002/NOPB

  • Manufacturer : Texas Instruments
    Series : WEBENCH? Buildit Board
    Part Status : Active
    Main Purpose : DC/DC, Step Down
    Board Type : Bare (Unpopulated)
    Supplied Contents : Board(s)
    Utilized IC / Part : LM3151/2/3

极速报价

型号
品牌 封装 批号 查看
TPS3307-18QDRG4Q1 TI 8-SOIC New 详细
ADC12J4000NKE10 TI 68-VQFN (10x10) New 详细
RR-IDISC-ANTMUX-A TI New 详细
LMV358IPWR TI 8-TSSOP New 详细
TMX320C6670CYP TI 841-FCBGA (24x24) New 详细
TAS5026IPAGG4 TI 64-TQFP (10x10) New 详细
SN74CB3Q16211DLR TI 56-SSOP New 详细
SN74AHCT273DGVRE4 TI New 详细
LP5900SD-2.0 TI 6-WSON (2.2x2.5) New 详细
TL432ACPKG3 TI SOT-89-3 New 详细
TPS3305-18D TI 8-SOIC New 详细
LM2940CS-15 TI DDPAK/TO-263-3 New 详细
TLV2333IDGKT TI 8-VSSOP New 详细
LP5907UVE-2.85/NOPB TI 4-DSBGA New 详细
CD74HC4514ENG4 TI 24-PDIP New 详细
LM2703MFX-ADJ TI SOT-23-5 New 详细
TPS54672PWP TI 28-HTSSOP New 详细
TPS55330RTET TI 16-WQFN (3x3) New 详细
TSB43AB21AIPDTEP TI 128-TQFP (14x14) New 详细
LMV431AIM5/NOPB TI SOT-23-5 New 详细