罗斌森
  • BQ500211ARGZT

  • Manufacturer : Texas Instruments
    Packaging : Tape & Reel (TR)
    Alternate Packaging
    Part Status : Not For New Designs
    Applications : Wireless Power Transmitter
    Current - Supply : 52mA
    Voltage - Supply : 3V ~ 3.6V
    Operating Temperature : -40°C ~ 110°C
    Mounting Type : Surface Mount
    Package / Case : 48-VFQFN Exposed Pad
    Supplier Device Package : 48-VQFN (7x7)

极速报价

型号
品牌 封装 批号 查看
UCC2819ANG4 TI 16-PDIP New 详细
74LVTH162244ZRDR TI 54-BGA MICROSTAR JUNIOR (8.0x5.5) New 详细
SN74AS885NT TI New 详细
TPS61175EVM-326 TI New 详细
SN74LVC1G06DCKRE4 TI New 详细
SE555DG4 TI 8-SOIC New 详细
LM3S6432-IQC50 TI 100-LQFP (14x14) New 详细
UA9638CDR TI 8-SOIC New 详细
MAX232ECPWR TI 16-TSSOP New 详细
BQ20Z75DBTR-V160G4 TI 38-TSSOP New 详细
LM5104SD TI 10-WSON (4x4) New 详细
CD74HCU04E TI 14-PDIP New 详细
TLV2624IPWR TI 14-TSSOP New 详细
LM4040C20QDBZT TI SOT-23-3 New 详细
TPS2063D TI 16-SOIC New 详细
LM25011AMYX TI 10-MSOP-PowerPad New 详细
LP3966ESX-1.8 TI DDPAK/TO-263-5 New 详细
TLC5948ADBQR TI 24-SSOP/QSOP New 详细
TPS62304YZDT TI 8-DSBGA (2.3x1.3) New 详细
INA125U TI 16-SOIC New 详细