罗斌森
  • BQ51011YFFR

  • Manufacturer : Texas Instruments
    Packaging : Tape & Reel (TR)
    Alternate Packaging
    Part Status : Not For New Designs
    Applications : Wireless Power Receiver
    Current - Supply : 1.5A
    Voltage - Supply : 4V ~ 10V
    Operating Temperature : 0°C ~ 125°C (TJ)
    Mounting Type : Surface Mount
    Package / Case : 28-UFBGA, DSBGA
    Supplier Device Package : 28-DSBGA (2.79x1.59)

极速报价

型号
品牌 封装 批号 查看
SN74HC125PWR TI 14-TSSOP New 详细
LM611IM TI 14-SOIC New 详细
SN74ALVC244PW TI 20-TSSOP New 详细
74ALVC16834DGVRE4 TI 56-TVSOP New 详细
LMH6732MF/NOPB TI SOT-23-6 New 详细
LMH6619QMAK/NOPB TI 8-SOIC New 详细
CY74FCT825ATSOCTG4 TI New 详细
LM2585S-5.0 TI DDPAK/TO-263-5 New 详细
AFE7070IRGZ25 TI 48-VQFN (7x7) New 详细
TPS62090QRGTRQ1 TI 16-QFN (3x3) New 详细
DRV8842PWP TI 28-HTSSOP New 详细
TPS79630KTTTG3 TI DDPAK/TO-263-5 New 详细
UC2543NG4 TI 16-PDIP New 详细
ADC16DV160CILQ/NOPB TI 68-VQFN (10x10) New 详细
INA111AU TI 16-SOIC New 详细
SN74HC163IPWRG4Q1 TI 16-TSSOP New 详细
TMS320DM6433ZWT4 TI 361-NFBGA (16x16) New 详细
SN74BCT29825NT TI New 详细
UCC28881EVM-680 TI New 详细
CD74HC4066M96 TI 14-SOIC New 详细