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  • BUF08630RGWR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Discontinued at Digi-Key
    Applications : TFT-LCD Panels: VCOM Driver
    Output Type : Rail-to-Rail
    Number of Circuits : 8
    Slew Rate : 45V/μs
    Current - Supply : 940μA
    Current - Output / Channel : 300mA
    Voltage - Supply, Single/Dual (±) : 9V ~ 20V
    Mounting Type : Surface Mount
    Package / Case : 20-VQFN Exposed Pad
    Supplier Device Package : 20-VQFN (5x5)

极速报价

型号
品牌 封装 批号 查看
LM3444MR16BSTRB/NOPB TI New 详细
SN74LVC16373AGQLR TI 56-BGA MICROSTAR JUNIOR (7.0x4.5) New 详细
TL4050B25QDCKR TI SC-70-5 New 详细
LP2950CZ-3.3/NOPB TI TO-92-3 New 详细
SN74AHCT139D TI 16-SOIC New 详细
BQ24251RGER TI 24-VQFN (4x4) New 详细
LM2575HVS-12 TI DDPAK/TO-263-5 New 详细
DS8923AMX/NOPB TI 16-SOIC New 详细
SN65LV1212DB TI 28-SSOP New 详细
REF3225AIDBVR TI SOT-23-6 New 详细
TLC2274IPWR TI 14-TSSOP New 详细
LM2678S-3.3 TI DDPAK/TO-263-7 New 详细
TS3V330RGYR TI 16-VQFN (4x4) New 详细
THS1060CPHP TI 48-HTQFP (7x7) New 详细
LM2673SD-ADJ TI 14-VSON (5x6) New 详细
ADC12C080CISQ TI 32-WQFN (5x5) New 详细
TPS780230300DRVT TI 6-SON (2x2) New 详细
S5LS10206ASPGEQQ1 TI 144-LQFP (20x20) New 详细
DS3695ATMX/NOPB TI 8-SOIC New 详细
DRV8601ZQVR TI 8-BGA MICROSTAR JUNIOR (2.1x2.1) New 详细