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  • BUF08630RGWT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Applications : TFT-LCD Panels: VCOM Driver
    Output Type : Rail-to-Rail
    Number of Circuits : 8
    Slew Rate : 45V/μs
    Current - Supply : 940μA
    Current - Output / Channel : 300mA
    Voltage - Supply, Single/Dual (±) : 9V ~ 20V
    Mounting Type : Surface Mount
    Package / Case : 20-VQFN Exposed Pad
    Supplier Device Package : 20-VQFN (5x5)

极速报价

型号
品牌 封装 批号 查看
TLV71713PDQNR TI 4-X2SON (1x1) New 详细
TLC084QPWPRQ1 TI 20-HTSSOP New 详细
SN65LVDM1677DGG TI 64-TSSOP New 详细
UCC37325D TI 8-SOIC New 详细
UA78M05CKCSE3 TI TO-220-3 New 详细
LP2996LQX TI 16-WQFN (4x4) New 详细
OPA4354AQPWRQ1 TI 14-TSSOP New 详细
SN74LV125ATDB TI 14-SSOP New 详细
ISO7763DBQR TI 16-SSOP New 详细
CD4536BDWR TI 16-SOIC New 详细
LMH6732MAX TI 8-SOIC New 详细
PCI2040PGE TI 144-LQFP (20x20) New 详细
TL3845BDR-8 TI 8-SOIC New 详细
DRV8432DKDR TI 36-HSSOP New 详细
BQ26231PWR TI 8-TSSOP New 详细
SN74AUP1G07DRYR TI 6-SON (1.45x1) New 详细
THS4226DGQ TI 10-MSOP-PowerPad New 详细
TAS5715EVM TI New 详细
LM3445TRIACEVAL TI New 详细
LMS1585AISX-3.3/NO TI DDPAK/TO-263-3 New 详细