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  • BUF08630RGWT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Applications : TFT-LCD Panels: VCOM Driver
    Output Type : Rail-to-Rail
    Number of Circuits : 8
    Slew Rate : 45V/μs
    Current - Supply : 940μA
    Current - Output / Channel : 300mA
    Voltage - Supply, Single/Dual (±) : 9V ~ 20V
    Mounting Type : Surface Mount
    Package / Case : 20-VQFN Exposed Pad
    Supplier Device Package : 20-VQFN (5x5)

极速报价

型号
品牌 封装 批号 查看
ADCS7478AIMFX TI SOT-23-6 New 详细
ADS8326IDGKT TI 8-VSSOP New 详细
LM2940T-5.0/LF08 TI TO-220-3 New 详细
MSP430F2618TPMR TI 64-LQFP (10x10) New 详细
TPIC46L03DBRG4 TI 28-SSOP New 详细
SN74AHC245MPWREP TI 20-TSSOP New 详细
TPS2062AD TI 8-SOIC New 详细
LMH7322EVAL/NOPB TI New 详细
ADC12038CIWM TI 28-SOIC New 详细
TPS3839G18DQNR TI 4-X2SON (1x1) New 详细
LM5072MH-50 TI 16-HTSSOP New 详细
LP8860RQVFPRQ1 TI 32-HLQFP (7x7) New 详细
TSM104WIDE4 TI 16-SOIC New 详细
LMS1585ACSX-1.5 TI DDPAK/TO-263-3 New 详细
EKK-LM3S1968 TI New 详细
TPS54525PWP TI 14-HTSSOP New 详细
TMDXEVM8168 TI New 详细
TSB41AB1GQE TI 80-BGA MICROSTAR JUNIOR (5x5) New 详细
MSP430F436IPZR TI 100-LQFP (14x14) New 详细
UCC2806QG3 TI 20-PLCC (9x9) New 详细