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  • BUF08630RGWT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Applications : TFT-LCD Panels: VCOM Driver
    Output Type : Rail-to-Rail
    Number of Circuits : 8
    Slew Rate : 45V/μs
    Current - Supply : 940μA
    Current - Output / Channel : 300mA
    Voltage - Supply, Single/Dual (±) : 9V ~ 20V
    Mounting Type : Surface Mount
    Package / Case : 20-VQFN Exposed Pad
    Supplier Device Package : 20-VQFN (5x5)

极速报价

型号
品牌 封装 批号 查看
LM3480IM3-15/NOPB TI SOT-23-3 New 详细
SN74F04N TI 14-PDIP New 详细
TLV5636CD TI 8-SOIC New 详细
SN74ABT640N TI 20-PDIP New 详细
LMR10510XMFX/NOPB TI SOT-23-5 New 详细
LP2989ILDX-3.0 TI 8-WSON (4x4) New 详细
LP5907QMFX-1.2Q1 TI SOT-23-5 New 详细
SN74LVC2G126YZPR TI 8-DSBGA, 8-WCSP (1.9x0.9) New 详细
PT4143C TI New 详细
DAC9881EVM-PDK TI New 详细
TSV912AIDGKR TI 8-VSSOP New 详细
CY74FCT574CTSOCT TI New 详细
TMP461AIRUNT TI 10-QFN (2x2) New 详细
LP3873ESX-1.8 TI DDPAK/TO-263-5 New 详细
PTH12010WAH TI New 详细
THS4140IDGNR TI 8-MSOP-PowerPad New 详细
LM2940S-10/NOPB TI DDPAK/TO-263-3 New 详细
SN74LS163ADR TI 16-SOIC New 详细
UC2846DW TI 16-SOIC New 详细
TMS320C6416TBCLZD1 TI 532-FC/CSP (23x23) New 详细