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  • BQ24093DGQR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad
    Supplier Device Package : 10-MSOP-PowerPad

极速报价

型号
品牌 封装 批号 查看
SN74CBT3257DBR TI 16-SSOP New 详细
TLK2226ZEA TI 196-BGA (15x15) New 详细
LM2940IMPX-12/NOPB TI SOT-223-4 New 详细
SN74AHCT132DGVR TI 14-TVSOP New 详细
AM26LS32ACN TI 16-PDIP New 详细
TIBPAL22V10-10CNT TI 24-PDIP New 详细
DS90CF561MTDX/NOPB TI 48-TSSOP New 详细
LP3882ES-1.8/NOPB TI DDPAK/TO-263-5 New 详细
UCC2808N-2 TI 8-PDIP New 详细
XTR110KU/1K TI 16-SOIC New 详细
SN74ALVCH16823DGGR TI New 详细
LP2986AIMX-5.0/NOPB TI 8-SOIC New 详细
SN74ALVCH162601GR TI 56-TSSOP New 详细
DK-LM3S301 TI New 详细
TL343IDBVRG4 TI SOT-23-5 New 详细
ADS5287EVM TI New 详细
MSP430F5630IZQWT TI 113-BGA Microstar Junior (7x7) New 详细
TPS22913BYZVT TI 4-DSBGA (0.88x0.88) New 详细
LM21212-1EVM/NOPB TI New 详细
TAS2770EVM TI New 详细