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  • BQ24093DGQR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad
    Supplier Device Package : 10-MSOP-PowerPad

极速报价

型号
品牌 封装 批号 查看
SN74LVC1G00DBVR TI SOT-23-5 New 详细
LP3871EMP-2.5 TI SOT-223-5 New 详细
TRF1121IRGZR TI 48-VQFN (7x7) New 详细
TLC374CN TI 14-PDIP New 详细
LM2853MH-3.0/NOPB TI 14-HTSSOP New 详细
TNETV2685VIDZUTA7 TI 529-FCBGA (19x19) New 详细
SN65HVD232DR TI 8-SOIC New 详细
LM4041CEM3-1.2/NOPB TI SOT-23-3 New 详细
AFE5805ZCF TI 135-NFBGA (15x9) New 详细
LDC1041NHRR TI 16-WSON (5x4) New 详细
CC1201EMK-868-930 TI New 详细
SN65LVDS180DRQ1 TI 14-SOIC New 详细
LM2930T-5.0/NOPB TI TO-220-3 New 详细
SN74AHCT245PWRG3 TI 20-TSSOP New 详细
LP2989IM-2.5 TI 8-SOIC New 详细
LM3503SQX-25/NOPB TI 16-WQFN (4x4) New 详细
TLV3012AIDBVT TI SOT-23-6 New 详细
LM2940LD-5.0/NOPB TI 8-WSON (4x4) New 详细
TPS2115PWR TI 8-TSSOP New 详细
TLC2272AQDG4 TI 8-SOIC New 详细