罗斌森
  • BQ24093DGQR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad
    Supplier Device Package : 10-MSOP-PowerPad

极速报价

型号
品牌 封装 批号 查看
PTMA401120A3AZ TI New 详细
DS90UB902QSQ/NOPB TI 40-WQFN (6x6) New 详细
LM3S6911-IQC50-A2T TI 100-LQFP (14x14) New 详细
SN74AS244ADWR TI 20-SOIC New 详细
TPS54620RGYT TI 14-VQFN (3.5x3.5) New 详细
SN74LS74AD TI New 详细
TS5A3160DBVT TI SOT-23-6 New 详细
TPA2039D1YFFR TI 9-DSBGA (1.2x1.3) New 详细
SN74LV245ADBR TI 20-SSOP New 详细
CD4076BM96E4 TI New 详细
UCC2813D-5 TI 8-SOIC New 详细
LMC7225IM5/NOPB TI SOT-23-5 New 详细
THS4513RGTR TI 16-QFN (3x3) New 详细
ADS1286U/2K5 TI 8-SOIC New 详细
LM4881N/NOPB TI 8-PDIP New 详细
SN74LVC2G17DCKR TI SC-70-6 New 详细
TLV2322ID TI 8-SOIC New 详细
LM3S3654-IQR50-C5 TI 64-LQFP (10x10) New 详细
ADS8320EVM TI New 详细
SN74AHC240DBRE4 TI 20-SSOP New 详细