罗斌森
  • BQ25504RGTR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Applications : Energy Harvesting
    Current - Supply : 330nA
    Voltage - Supply : 2.5V ~ 5.25V
    Operating Temperature : -40°C ~ 85°C
    Mounting Type : Surface Mount
    Package / Case : 16-VFQFN Exposed Pad
    Supplier Device Package : 16-VQFN (3x3)

极速报价

型号
品牌 封装 批号 查看
SN74LVC2G157YZAR TI 8-DSBGA, 8-WCSP (1.9x0.9) New 详细
SN74LV125AN TI 14-PDIP New 详细
SN74LVTH125IPWREP TI 14-TSSOP New 详细
TLV320AIC1110GQER TI 80-BGA MICROSTAR JUNIOR (5x5) New 详细
SN74LVC1G123DCUT TI US8 New 详细
TLV272IP TI 8-PDIP New 详细
SN74HC645NSRE4 TI 20-SO New 详细
ADC3241EVM TI New 详细
MSP430FR5994IZVW TI 87-NFBGA (6x6) New 详细
TPS389025QDSERQ1 TI 6-WSON (1.5x1.5) New 详细
DAC8814IBDBT TI 28-SSOP New 详细
DRV592VFP TI 32-HLQFP (7x7) New 详细
MC79L15CD TI 8-SOIC New 详细
TL064BCDR TI 14-SOIC New 详细
LM2931ASX-5.0 TI DDPAK/TO-263-3 New 详细
LMC555CMX/NOPB TI 8-SOIC New 详细
DAC104S085CISDX TI 10-WSON (3x3) New 详细
THS4081CDGNR TI 8-MSOP-PowerPad New 详细
UCC27424DR TI 8-SOIC New 详细
LP3996SDX-0833/NOPB TI 10-WSON (3x3) New 详细