产品系列
CC2640R2FRGZR
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : SimpleLink?
Part Status : Active
Type : TxRx + MCU
RF Family/Standard : Bluetooth
Protocol : Bluetooth v5.0
Modulation : GFSK
Frequency : 2.4GHz
Data Rate (Max) : 2Mbps
Power - Output : 5dBm
Sensitivity : -97dBm
Memory Size : 128kB Flash, 20kB RAM
Serial Interfaces : I2C, I2S, SPI, UART
GPIO : 31
Voltage - Supply : 1.8V ~ 3.8V
Current - Receiving : 5.9mA
Current - Transmitting : 9.1mA
Operating Temperature : -40°C ~ 85°C
Mounting Type : Surface Mount
Package / Case : 48-VFQFN Exposed Pad
Supplier Device Package : 48-VQFN (7x7)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| REG1117FA-2.5KTTT | TI | DDPAK/TO-263-3 | New | 详细 | |
| LM3S3Z26-IQR50-C5 | TI | 64-LQFP (10x10) | New | 详细 | |
| SN74LV138ARGYR | TI | 16-VQFN (4x4) | New | 详细 | |
| BQ7790505PW | TI | 20-TSSOP | New | 详细 | |
| TPS76330QDBVRG4Q1 | TI | SOT-23-5 | New | 详细 | |
| LMV854MTX/NOPB | TI | 14-TSSOP | New | 详细 | |
| SN74LV163ARGYR | TI | 16-VQFN (4x4) | New | 详细 | |
| LMC6034IMX/NOPB | TI | 14-SOIC | New | 详细 | |
| TPS3307-18DGNR | TI | 8-MSOP-PowerPad | New | 详细 | |
| TMS5702124CPGEQQ1 | TI | 144-LQFP (20x20) | New | 详细 | |
| TPIC74100QPWPRQ1 | TI | 20-HTSSOP | New | 详细 | |
| LM3524DM/NOPB | TI | 16-SOIC | New | 详细 | |
| LMV226URX/NOPB | TI | 4-DSBGA | New | 详细 | |
| LM6142BIMX | TI | 8-SOIC | New | 详细 | |
| SN74V263-10GGM | TI | 100-BGA MICROSTAR (10.1x10.1) | New | 详细 | |
| TMDSCNCD28M36 | TI | New | 详细 | ||
| UCC3918DP | TI | 16-SOIC | New | 详细 | |
| LM5005MH | TI | 20-HTSSOP | New | 详细 | |
| LP2992IM5X-3.3/NOPB | TI | SOT-23-5 | New | 详细 | |
| LM2595SX-3.3/NOPB | TI | DDPAK/TO-263-5 | New | 详细 |
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