产品系列
产品系列
CSD17309Q3
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : NexFET?
Part Status : Active
FET Type : N-Channel
Technology : MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) : 30V
Current - Continuous Drain (Id) @ 25°C : 20A (Ta), 60A (Tc)
Drive Voltage (Max Rds On, Min Rds On) : 3V, 8V
Rds On (Max) @ Id, Vgs : 5.4 mOhm @ 18A, 8V
Vgs(th) (Max) @ Id : 1.7V @ 250μA
Gate Charge (Qg) (Max) @ Vgs : 10nC @ 4.5V
Vgs (Max) : +10V, -8V
Input Capacitance (Ciss) (Max) @ Vds : 1440pF @ 15V
Power Dissipation (Max) : 2.8W (Ta)
Operating Temperature : -55°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Supplier Device Package : 8-VSON-CLIP (3.3x3.3)
Package / Case : 8-PowerTDFN
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TLV3702IDR | TI | 8-SOIC | New | 详细 | |
| TPS77401DGKR | TI | 8-VSSOP | New | 详细 | |
| DRV8803DWR | TI | 20-SOIC | New | 详细 | |
| TLV320ADC3001IYZHR | TI | 16-DSBGA (2.24x2.16) | New | 详细 | |
| TPS2114APWR | TI | 8-TSSOP | New | 详细 | |
| HD3SS460IRHRT | TI | 28-WQFN (5.5x3.5) | New | 详细 | |
| DS26LS32CMX | TI | 16-SOIC | New | 详细 | |
| CD74AC00E | TI | 14-PDIP | New | 详细 | |
| LP38843SX-1.2/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| ADS7223SRHBT | TI | 32-VQFN (5x5) | New | 详细 | |
| LMX2531LQ3010E/NOPB | TI | New | 详细 | ||
| LMK03318RHST | TI | 48-WQFN (7x7) | New | 详细 | |
| ADC121S051CISDX/NOPB | TI | 6-WSON (2.2x2.5) | New | 详细 | |
| SN74AC563DBR | TI | 20-SSOP | New | 详细 | |
| TPS65300EVM | TI | New | 详细 | ||
| MSP430G2221IRSAQ1 | TI | 16-QFN (4x4) | New | 详细 | |
| SN74LS377DWR | TI | New | 详细 | ||
| LM3S9997-IBZ80-C5 | TI | 108-BGA (10x10) | New | 详细 | |
| LM1972MX/NOPB | TI | 20-SOIC | New | 详细 | |
| TPS75815KTTT | TI | DDPAK/TO-263-5 | New | 详细 |
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