产品系列
产品系列
CSD17309Q3
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : NexFET?
Part Status : Active
FET Type : N-Channel
Technology : MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) : 30V
Current - Continuous Drain (Id) @ 25°C : 20A (Ta), 60A (Tc)
Drive Voltage (Max Rds On, Min Rds On) : 3V, 8V
Rds On (Max) @ Id, Vgs : 5.4 mOhm @ 18A, 8V
Vgs(th) (Max) @ Id : 1.7V @ 250μA
Gate Charge (Qg) (Max) @ Vgs : 10nC @ 4.5V
Vgs (Max) : +10V, -8V
Input Capacitance (Ciss) (Max) @ Vds : 1440pF @ 15V
Power Dissipation (Max) : 2.8W (Ta)
Operating Temperature : -55°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Supplier Device Package : 8-VSON-CLIP (3.3x3.3)
Package / Case : 8-PowerTDFN
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| UCC35702PW | TI | 14-TSSOP | New | 详细 | |
| CD74HC564M | TI | New | 详细 | ||
| TLV2465ID | TI | 16-SOIC | New | 详细 | |
| ADS8578SIPMR | TI | 64-LQFP (10x10) | New | 详细 | |
| LM4865MX/NOPB | TI | 8-SOIC | New | 详细 | |
| TLK10022CTR | TI | 144-FCBGA (13x13) | New | 详细 | |
| LM360H/NOPB | TI | TO-5-8 | New | 详细 | |
| CD74HCT273M | TI | New | 详细 | ||
| LP5900TL-4.5/NOPB | TI | 4-DSBGA (1x1) | New | 详细 | |
| OPA2613IDTJ | TI | 8-HSOP | New | 详细 | |
| TLVH431ACPK | TI | SOT-89-3 | New | 详细 | |
| OPA2170AIDCUR | TI | 8-VSSOP | New | 详细 | |
| SRC4192EVM | TI | New | 详细 | ||
| TMS320C6412AZNZ5 | TI | 548-FCBGA (27x27) | New | 详细 | |
| SN74LS442N | TI | 20-PDIP | New | 详细 | |
| UCC2808AQDR-2Q1 | TI | 8-SOIC | New | 详细 | |
| TS5A22362DRCR | TI | 10-VSON (3x3) | New | 详细 | |
| ADS1120IPW | TI | 16-TSSOP | New | 详细 | |
| SN74LV1T08DBVR | TI | SOT-23-5 | New | 详细 | |
| LMX9830SM/NOPB | TI | New | 详细 |
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