产品系列
产品系列
CSD17313Q2Q1
- Manufacturer : Texas Instruments
Packaging : Tape & Reel (TR)
Alternate Packaging
Series : Automotive, AEC-Q100, NexFET?
Part Status : Not For New Designs
FET Type : N-Channel
Technology : MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) : 30V
Current - Continuous Drain (Id) @ 25°C : 5A (Tc)
Drive Voltage (Max Rds On, Min Rds On) : 3V, 8V
Rds On (Max) @ Id, Vgs : 30 mOhm @ 4A, 8V
Vgs(th) (Max) @ Id : 1.8V @ 250μA
Gate Charge (Qg) (Max) @ Vgs : 2.7nC @ 4.5V
Vgs (Max) : +10V, -8V
Input Capacitance (Ciss) (Max) @ Vds : 340pF @ 15V
Power Dissipation (Max) : 2.3W (Ta)
Operating Temperature : -55°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Supplier Device Package : 6-WSON (2x2)
Package / Case : 6-WDFN Exposed Pad
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| CY74FCT2257CTQCT | TI | 16-SSOP | New | 详细 | |
| TPS73025DBVR | TI | SOT-23-5 | New | 详细 | |
| SN74LV367ADGVR | TI | 16-TVSOP | New | 详细 | |
| LM3S1621-IBZ80-C3T | TI | 108-BGA (10x10) | New | 详细 | |
| RF430FRL153HCRGER | TI | 24-VQFN (4x4) | New | 详细 | |
| PCA9543ADR | TI | 14-SOIC | New | 详细 | |
| TMDSHSECDOCK | TI | New | 详细 | ||
| CC1070RGP | TI | New | 详细 | ||
| LP2986IMX-3.3/NOPB | TI | 8-SOIC | New | 详细 | |
| UC5603NG4 | TI | 16-PDIP | New | 详细 | |
| ADC0804LCWM/NOPB | TI | 20-SOIC | New | 详细 | |
| TPS62620YFFR | TI | 6-DSBGA | New | 详细 | |
| LM237KC | TI | TO-220-3 | New | 详细 | |
| THS4509RGTT | TI | 16-QFN (3x3) | New | 详细 | |
| BQ4845S-A4 | TI | 28-SOIC | New | 详细 | |
| CD74HC299M96 | TI | 20-SOIC | New | 详细 | |
| CD4052BNSR | TI | 16-SO | New | 详细 | |
| SN74ALS299NSRG4 | TI | 20-SO | New | 详细 | |
| SN74LVC04APWRG4 | TI | 14-TSSOP | New | 详细 | |
| LP5907SNX-2.2/NOPB | TI | 4-X2SON (1x1) | New | 详细 |
请把您的采购需求告诉我们！
Copyright © 2007-2021 All Rights Reserved. - 深圳市罗斌森电子科技有限公司
E-MAIL: 2500045293@QQ.COM
备案号粤ICP备2021120841号
E-MAIL: 2500045293@QQ.COM
备案号粤ICP备2021120841号
网站设计webdesign www.wzdzkf.com