产品系列
产品系列
DBB03AIPM
- Manufacturer : Texas Instruments
Packaging : Tray
Part Status : Obsolete
Function : Baseband ASIC for Dolphin Chipset
Secondary Attributes : Baseband ASIC for Dolphin Chipset
Package / Case : 64-LQFP
Supplier Device Package : 64-LQFP (10x10)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TPD2S703QDSKRQ1 | TI | 10-WSON (2.5x2.5) | New | 详细 | |
| DIYAMP-SOT23-EVM | TI | New | 详细 | ||
| SN74LVC3G14DCUT | TI | US8 | New | 详细 | |
| TLV2773CDGSRG4 | TI | 10-VSSOP | New | 详细 | |
| LM3622M-8.4/NOPB | TI | 8-SOIC | New | 详细 | |
| PGA460TPWRQ1 | TI | 16-TSSOP | New | 详细 | |
| LMS5214IMGX-2.8/NOPB | TI | SC-70-5 | New | 详细 | |
| CSD17579Q5A | TI | 8-VSONP (5x6) | New | 详细 | |
| TPS3306-15DR | TI | 8-SOIC | New | 详细 | |
| LP3971SQX-B410/NOPB | TI | 40-WQFN (5x5) | New | 详细 | |
| DS91D176TMA/NOPB | TI | 8-SOIC | New | 详细 | |
| LMV931MFX/NOPB | TI | SOT-23-5 | New | 详细 | |
| LP2988AIMX-5.0 | TI | 8-SOIC | New | 详细 | |
| MSP430FR5738IYQDR | TI | 24-DSBGA | New | 详细 | |
| ADS1263IPW | TI | 28-TSSOP | New | 详细 | |
| LP3966ES-5.0/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| LM5060Q1MMX/NOPB | TI | 10-VSSOP | New | 详细 | |
| LP2987ILD-3.3 | TI | 8-WSON (4x4) | New | 详细 | |
| TPS7430D | TI | 8-SOIC | New | 详细 | |
| TAS5733LDCA | TI | 48-HTSSOP | New | 详细 |
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