产品系列
产品系列
CSD17318Q2
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : NexFET?
Part Status : Active
FET Type : N-Channel
Technology : MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) : 30V
Current - Continuous Drain (Id) @ 25°C : 25A (Tc)
Drive Voltage (Max Rds On, Min Rds On) : 2.5V, 8V
Rds On (Max) @ Id, Vgs : 15.1 mOhm @ 8A, 8V
Vgs(th) (Max) @ Id : 1.2V @ 250μA
Gate Charge (Qg) (Max) @ Vgs : 6nC @ 4.5V
Vgs (Max) : ±10V
Input Capacitance (Ciss) (Max) @ Vds : 879pF @ 15V
Power Dissipation (Max) : 16W (Tc)
Operating Temperature : -55°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Supplier Device Package : 6-WSON (2x2)
Package / Case : 6-WDFN Exposed Pad
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| SN74LS373NG4 | TI | 20-PDIP | New | 详细 | |
| COP8CFE9IMT9/NOPB | TI | 48-TSSOP | New | 详细 | |
| LMC6484AIMX | TI | 14-SOIC | New | 详细 | |
| TPS610993YFFT | TI | 6-DSBGA (1.26x0.86) | New | 详细 | |
| LMX2505LQ1321/NOPB | TI | 28-WQFN (5x5) | New | 详细 | |
| DS92LV1021TMSAX | TI | 28-SSOP | New | 详细 | |
| CD4072BM | TI | 14-SOIC | New | 详细 | |
| LPC662AIM | TI | 8-SOIC | New | 详细 | |
| TLC59281RGER | TI | 24-VQFN (4x4) | New | 详细 | |
| UC2903DW | TI | 18-SOIC | New | 详细 | |
| TLV0838IN | TI | 20-PDIP | New | 详细 | |
| SN74LVC2G32QDCURQ1 | TI | US8 | New | 详细 | |
| SN74CBT3244CDBRE4 | TI | 20-SSOP | New | 详细 | |
| LP3965EMP-1.8 | TI | SOT-223-5 | New | 详细 | |
| 78ST136SC | TI | New | 详细 | ||
| DS91M125TMA/NOPB | TI | 16-SOIC | New | 详细 | |
| OMAPL137BZKBA3 | TI | 256-BGA (17x17) | New | 详细 | |
| OPA548FKTWT | TI | DDPAK/TO-263-7 | New | 详细 | |
| LM25019MRX/NOPB | TI | 8-SO PowerPad | New | 详细 | |
| UC2843N | TI | 8-PDIP | New | 详细 |
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