产品系列
产品系列
CSD17318Q2T
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : NexFET?
Part Status : Active
FET Type : N-Channel
Technology : MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) : 30V
Current - Continuous Drain (Id) @ 25°C : 25A (Tc)
Drive Voltage (Max Rds On, Min Rds On) : 2.5V, 8V
Rds On (Max) @ Id, Vgs : 15.1 mOhm @ 8A, 8V
Vgs(th) (Max) @ Id : 1.2V @ 250μA
Gate Charge (Qg) (Max) @ Vgs : 6nC @ 4.5V
Vgs (Max) : ±10V
Input Capacitance (Ciss) (Max) @ Vds : 879pF @ 15V
Power Dissipation (Max) : 16W (Tc)
Operating Temperature : -55°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Supplier Device Package : 6-WSON (2x2)
Package / Case : 6-WDFN Exposed Pad
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| OPA2111KM | TI | TO-99-8 | New | 详细 | |
| LMV722ID | TI | 8-SOIC | New | 详细 | |
| LM3S300-EQN25-C2T | TI | 48-LQFP (7x7) | New | 详细 | |
| LM5020EVAL/NOPB | TI | New | 详细 | ||
| TPS8268105SIPT | TI | 9-USIP | New | 详细 | |
| LMX2336USLEX | TI | 20-ULGA (3.5x3.5) | New | 详细 | |
| AM4376BZDND30 | TI | 491-NFBGA (17x17) | New | 详细 | |
| LMX2312USLDX/NOPB | TI | 20-UTCSP (3.5x3.5) | New | 详细 | |
| TLV431ACLP | TI | TO-92-3 | New | 详细 | |
| SN74LVTH182512DGGR | TI | 64-TSSOP | New | 详细 | |
| TL071ACDR | TI | 8-SOIC | New | 详细 | |
| MSP430F2112IRHBT | TI | 32-VQFN (5x5) | New | 详细 | |
| LMX2335USLBX | TI | 16-CSP (3.5x3.5) | New | 详细 | |
| OPA548T-1 | TI | TO-220-7 | New | 详细 | |
| LP3856ET-1.8 | TI | TO-220-5 | New | 详细 | |
| LP3965ET-3.3/LB04 | TI | TO-220-5 | New | 详细 | |
| OPA333AIDBVR | TI | SOT-23-5 | New | 详细 | |
| ADS6143EVM | TI | New | 详细 | ||
| LM3S9U96-IQC80-A2T | TI | 100-LQFP (14x14) | New | 详细 | |
| SN74AHCT574PWR | TI | New | 详细 |
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