罗斌森
  • CD74HC4067M96

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Multiplexer/Demultiplexer Circuit : 16:1
    Number of Circuits : 1
    On-State Resistance (Max) : 160 Ohm
    Channel-to-Channel Matching (δRon) : 8.5 Ohm
    Voltage - Supply, Single (V+) : 2V ~ 6V
    Switch Time (Ton, Toff) (Max) : 51ns, 49ns
    -3db Bandwidth : 89MHz
    Channel Capacitance (CS(off), CD(off)) : 5pF, 50pF
    Current - Leakage (IS(off)) (Max) : 800nA
    Operating Temperature : -55°C ~ 125°C (TA)
    Package / Case : 24-SOIC (0.295", 7.50mm Width)
    Supplier Device Package : 24-SOIC

极速报价

型号
品牌 封装 批号 查看
OPA2356AIDR TI 8-SOIC New 详细
2U3836H30QDBVRG4Q1 TI SOT-23-5 New 详细
CD74HCT373M TI 20-SOIC New 详细
LM2592HVS-3.3 TI DDPAK/TO-263-5 New 详细
CD4086BPW TI 14-TSSOP New 详细
SN74HCT00N TI 14-PDIP New 详细
SN74AC533NSRG4 TI 20-SO New 详细
SN75LVDT386DGGR TI 64-TSSOP New 详细
MSP430F2618TGQWTEP TI 113-BGA Microstar Junior (7x7) New 详细
LM2673SX-3.3 TI DDPAK/TO-263-7 New 详细
SN74AUC1G86YEAR TI 5-DSBGA, 5-WCSP (1.4x0.9) New 详细
SN74AS241AN TI 20-PDIP New 详细
TMDX570LC43HDK TI New 详细
SN74AUP1G240DSFR TI 6-SON (1x1) New 详细
LM4050CIM3X-5.0/NOPB TI SOT-23-3 New 详细
TSU6712YFPRB TI 25-DSBGA (2x2) New 详细
DAC122S085CISDX/NOPB TI 10-WSON (3x3) New 详细
TLV7163030PDPQR TI 6-X2SON (1.2x1.2) New 详细
TL750M08QKVURQ1 TI TO-252-3 New 详细
TRF37D73IDSGR TI 8-WSON (2x2) New 详细