产品系列

罗斌森
  • BUF634FKTTTE3

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Amplifier Type : Buffer
    Number of Circuits : 1
    Slew Rate : 2000V/μs
    -3db Bandwidth : 180MHz
    Current - Input Bias : 5μA
    Voltage - Input Offset : 30mV
    Current - Supply : 15mA
    Current - Output / Channel : 250mA
    Voltage - Supply, Single/Dual (±) : 4.5V ~ 36V, ±2.25V ~ 18V
    Operating Temperature : -40°C ~ 85°C
    Mounting Type : Surface Mount
    Package / Case : TO-263-6, D2Pak (5 Leads + Tab), TO-263BA
    Supplier Device Package : DDPAK/TO-263-5

极速报价

型号
品牌 封装 批号 查看
LM4898LDX/NOPB TI 10-WSON (3x4) New 详细
CD74HCT40105E TI 16-PDIP New 详细
TMS320C6415TBZLZA8 TI 532-FCBGA (23x23) New 详细
LMX2531LQ1312E/NOPB TI 36-WQFN (6x6) New 详细
LP2992AILDX-1.8 TI 6-WSON (2.92x3.29) New 详细
CD4040BM96 TI 16-SOIC New 详细
BQ4050RSMR TI 32-VQFN (4x4) New 详细
LM78L05ACMX TI 8-SOIC New 详细
CD74HC157M TI 16-SOIC New 详细
CSD87335Q3D TI 8-LSON (3.3x3.3) New 详细
DP83849IDVSX/NOPB TI 80-TQFP (12x12) New 详细
SN74LVC1G27YZPR TI 6-DSBGA, 6-WCSP (1.4x0.9) New 详细
LP38690SDX-5.0 TI 6-WSON (3x3) New 详细
DAC7512E/2K5 TI 8-VSSOP New 详细
TL7702BCD TI 8-SOIC New 详细
LM79L05ACZ/NOPB TI TO-92-3 New 详细
TPS77133DGKR TI 8-VSSOP New 详细
LP3891ET-1.5/NOPB TI TO-220-5 New 详细
LM2679SX-ADJ TI DDPAK/TO-263-7 New 详细
SN74AS576DWRE4 TI New 详细