罗斌森
  • DAC38RF87IAAV

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Series : *
    Part Status : Active
    Package / Case : 144-FBGA, FCBGA
    Supplier Device Package : 144-FCBGA (10x10)
    Mounting Type : Surface Mount

极速报价

型号
品牌 封装 批号 查看
LP38842SX-1.2 TI DDPAK/TO-263-5 New 详细
ISO5851QDWRQ1 TI 16-SOIC New 详细
TPS62172QDSGRQ1 TI 8-WSON (2x2) New 详细
COP8CCR9LVA8 TI 68-PLCC (24.23x24.23) New 详细
LP38502TS-ADJ/NOPB TI DDPAK/TO-263-5 New 详细
CC3220S-LAUNCHXL TI New 详细
OPA659IDRBT TI 8-SON (3x3) New 详细
TLC5944PWPR TI 28-HTSSOP New 详细
PCM4204PAPR TI 64-HTQFP (10x10) New 详细
TPS68000DBT TI 30-TSSOP New 详细
LM2672N-5.0 TI 8-PDIP New 详细
ADC08D500CIYB TI 128-HLQFP (20x20) New 详细
TPS54900PWR TI 16-TSSOP New 详细
TLV2473CDR TI 14-SOIC New 详细
TLC2254AIDR TI 14-SOIC New 详细
TPS7301QP TI 8-PDIP New 详细
ADS1299-4PAGR TI 64-TQFP (10x10) New 详细
MSP430F2013IPW TI 14-TSSOP New 详细
SN74F521NSR TI New 详细
NA555DR TI 8-SOIC New 详细