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  • DS25BR110TSD/NOPB

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Type : Buffer, ReDriver
    Applications : LVDS
    Input : LVDS
    Output : LVDS
    Data Rate (Max) : 3.125Gbps
    Number of Channels : 1
    Delay Time : 350ps
    Signal Conditioning : Input Equalization
    Capacitance - Input : 1.7pF
    Voltage - Supply : 3V ~ 3.6V
    Current - Supply : 35mA
    Operating Temperature : -40°C ~ 85°C
    Mounting Type : Surface Mount
    Package / Case : 8-WFDFN Exposed Pad
    Supplier Device Package : 8-WSON (3x3)

极速报价

型号
品牌 封装 批号 查看
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UC2861N TI 16-PDIP New 详细
TPS53310RGTT TI 16-QFN (3x3) New 详细
UA7812CKTTRG3 TI DDPAK/TO-263-3 New 详细
SN74LV374ATPWRG4Q1 TI New 详细
INA208AID TI 14-SOIC New 详细
SN74ALS638A-1DWR TI 20-SOIC New 详细
TLV320AIC23EVM2 TI New 详细
CD74HC688M96 TI New 详细
ISO722QDRQ1 TI 8-SOIC New 详细
CC1100RTK TI New 详细
SN74LVC1G04YZPR TI 5-DSBGA, 5-WCSP (1.4x0.9) New 详细
74AC11008N TI 16-PDIP New 详细
BQ51014YFPT TI 28-DSBGA New 详细
LM3S1H11-IQC50-A1 TI 100-LQFP (14x14) New 详细
SN74CB3T16210DGGR TI 48-TSSOP New 详细
LM3150MHX/NOPB TI 14-HTSSOP New 详细