产品系列
DS25BR150TSD/NOPB
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Part Status : Active
Type : Buffer, ReDriver
Applications : LVDS
Input : CML, LVDS, LVPECL
Output : LVDS
Data Rate (Max) : 3.125Gbps
Number of Channels : 1
Delay Time : 350ps
Capacitance - Input : 1.7pF
Voltage - Supply : 3V ~ 3.6V
Current - Supply : 27mA
Operating Temperature : -40°C ~ 85°C
Mounting Type : Surface Mount
Package / Case : 8-WFDFN Exposed Pad
Supplier Device Package : 8-WSON (3x3)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TLV2432AQDR | TI | 8-SOIC | New | 详细 | |
| SN74AHCT157PW | TI | 16-TSSOP | New | 详细 | |
| UCC28730D | TI | 7-SOIC | New | 详细 | |
| BQ27621YZFT-G1A | TI | 9-DSBGA | New | 详细 | |
| TPS548A20EVM-737 | TI | New | 详细 | ||
| DRV8821EVM | TI | New | 详细 | ||
| SN74AHCT16373DL | TI | 48-SSOP | New | 详细 | |
| LM2575HVT-15 | TI | TO-220-5 | New | 详细 | |
| ADS4222IRGCT | TI | 64-VQFN (9x9) | New | 详细 | |
| TPS54341DPRT | TI | 10-WSON (4x4) | New | 详细 | |
| 74ACT16373DLR | TI | 48-SSOP | New | 详细 | |
| TLC083IDGQ | TI | 10-MSOP-PowerPad | New | 详细 | |
| TPS3808G01DRVT | TI | 6-WSON (2x2) | New | 详细 | |
| LP3470IM5-4.38 | TI | SOT-23-5 | New | 详细 | |
| MSP430F2274IYFFR | TI | 49-DSBGA (2.8x2.8) | New | 详细 | |
| LM4040AIM3X-2.0/NOPB | TI | SOT-23-3 | New | 详细 | |
| SN74HC7001D | TI | 14-SOIC | New | 详细 | |
| TPS5130QPTRQ1 | TI | 48-LQFP (7x7) | New | 详细 | |
| TMS320DM6467CCUT4 | TI | 529-FCBGA (19x19) | New | 详细 | |
| MSP430F1481IRTDT | TI | 64-VQFN (9x9) | New | 详细 |
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