产品系列

罗斌森
  • DS25BR204TSQ/NOPB

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Type : Buffer, Multiplexer
    Applications : LVDS
    Input : CML, LVDS, LVPECL
    Output : LVDS
    Data Rate (Max) : 3.125Gbps
    Number of Channels : 1 x 2:4
    Delay Time : 460ps
    Signal Conditioning : Input Equalization, Output Pre-Emphasis
    Capacitance - Input : 1.7pF
    Voltage - Supply : 3V ~ 3.6V
    Current - Supply : 150mA
    Operating Temperature : -40°C ~ 85°C
    Mounting Type : Surface Mount
    Package / Case : 40-WFQFN Exposed Pad
    Supplier Device Package : 40-WQFN (6x6)

极速报价

型号
品牌 封装 批号 查看
BQ25015RHLT TI 20-VQFN (3.5x4.5) New 详细
CDCE949PW TI 24-TSSOP New 详细
DAC8162TDGSR TI 10-VSSOP New 详细
CD74HCT138E TI 16-PDIP New 详细
SN74LVC1G58YEPR TI 6-DSBGA, 6-WCSP (1.4x0.9) New 详细
TPA3001D1EVM TI New 详细
LM20323MHX/NOPB TI 20-HTSSOP New 详细
SN74ABT3612-20PQ TI 132-BQFP (24.54x24.54) New 详细
LMP2234AMAX/NOPB TI 14-SOIC New 详细
ISO7741FDW TI 16-SOIC New 详细
TPS2011APWP TI 14-HTSSOP New 详细
LM323K STEEL/NOPB TI TO-3-2 New 详细
LM3677TL-1.8EV TI New 详细
PTH04070WAZ TI New 详细
LP38855S-1.2 TI DDPAK/TO-263-5 New 详细
SN74AHC541NSR TI 20-SO New 详细
TPS62410QDRCRQ1 TI 10-VSON (3x3) New 详细
LMZ13608EVAL/NOPB TI New 详细
UCD8220QPWPRQ1 TI 16-HTSSOP New 详细
COP8CCR9LVA8 TI 68-PLCC (24.23x24.23) New 详细