产品系列

罗斌森
  • CSD86360Q5D

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : NexFET?
    Part Status : Active
    FET Type : 2 N-Channel (Half Bridge)
    FET Feature : Logic Level Gate
    Drain to Source Voltage (Vdss) : 25V
    Current - Continuous Drain (Id) @ 25°C : 50A
    Vgs(th) (Max) @ Id : 2.1V @ 250μA
    Gate Charge (Qg) (Max) @ Vgs : 12.6nC @ 4.5V
    Input Capacitance (Ciss) (Max) @ Vds : 2060pF @ 12.5
    Power - Max : 13W
    Operating Temperature : -55°C ~ 150°C (TJ)
    Mounting Type : Surface Mount
    Package / Case : 8-PowerLDFN
    Supplier Device Package : 8-LSON (5x6)

极速报价

型号
品牌 封装 批号 查看
LM3S1816-IQR50-C3 TI 64-LQFP (10x10) New 详细
TPS79533DCQ TI SOT-223-6 New 详细
LM9071S TI DDPAK/TO-263-5 New 详细
LM3S3J26-IQR50-C3 TI 64-LQFP (10x10) New 详细
TPS65252EVM TI New 详细
ADC10738CIWM TI 24-SOIC New 详细
BQ29412DCT3R TI SM8 (SSOP) New 详细
ADS6422IRGCT TI 64-VQFN (9x9) New 详细
THS3095EVM TI New 详细
OPA4192ID TI 14-SOIC New 详细
UCC3580DTR-1 TI 16-SOIC New 详细
CC2545RTCR TI 48-VQFN (7x7) New 详细
LM3S618-IGZ50-C2 TI 48-VQFN (7x7) New 详细
SN74ALS679DWG4 TI New 详细
TPS3851G18EDRBR TI 8-SON (3x3) New 详细
UCC27712EVM-287 TI New 详细
UCC28084DR TI 8-SOIC New 详细
TLC074CD TI 14-SOIC New 详细
MSP430F2013IN TI 14-PDIP New 详细
TRF6903PTR TI New 详细