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  • CSD87313DMS

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : NexFET?
    Part Status : Active
    FET Type : 2 N-Channel (Dual) Common Drain
    FET Feature : Standard
    Drain to Source Voltage (Vdss) : 30V
    Vgs(th) (Max) @ Id : 1.25V @ 250μA
    Gate Charge (Qg) (Max) @ Vgs : 28nC @ 4.5V
    Input Capacitance (Ciss) (Max) @ Vds : 4290pF @ 15V
    Operating Temperature : -55°C ~ 150°C (TJ)
    Mounting Type : Surface Mount
    Package / Case : 8-PowerWDFN
    Supplier Device Package : 8-WSON (3.3x3.3)

极速报价

型号
品牌 封装 批号 查看
TLC59582RTQR TI 56-QFN (8x8) New 详细
SN74LVC1G0832DBVT TI SOT-23-6 New 详细
SN74ALS873BNT TI 24-PDIP New 详细
DS90C402MX TI 8-SOIC New 详细
RM46L430ZWTT TI 337-NFBGA (16x16) New 详细
TIBPAL16R8-5CN TI 20-PDIP New 详细
SN74HC163NSR TI 16-SO New 详细
DM388AAAR21 TI 609-FCBGA (16x16) New 详细
LM3404HVEVAL/NOPB TI New 详细
ADS7861EVM TI New 详细
LP3990QTLX-1.8Q1 TI 4-DSBGA (1x1) New 详细
TLVH432AIDBZTG4 TI SOT-23-3 New 详细
TPS72325QDBVRQ1 TI SOT-23-5 New 详细
LM3S1G21-IQC80-A1 TI 100-LQFP (14x14) New 详细
TPS82692SIPR TI 8-uSIP New 详细
74ACT11032PWE4 TI 16-TSSOP New 详细
SN74HC161PWT TI 16-TSSOP New 详细
SN75C3243PW TI 28-TSSOP New 详细
LP3964EMPX-5.0 TI SOT-223-5 New 详细
LM2673SX-ADJ/NOPB TI DDPAK/TO-263-7 New 详细