产品系列

罗斌森
  • ISO7131CCDBQR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Technology : Capacitive Coupling
    Type : General Purpose
    Isolated Power : No
    Number of Channels : 3
    Inputs - Side 1/Side 2 : 2/1
    Channel Type : Unidirectional
    Voltage - Isolation : 2500Vrms
    Common Mode Transient Immunity (Min) : 25kV/μs
    Data Rate : 50Mbps
    Propagation Delay tpLH / tpHL (Max) : 35ns, 35ns
    Pulse Width Distortion (Max) : 3ns
    Rise / Fall Time (Typ) : 2ns, 2ns
    Voltage - Supply : 2.7V ~ 5.5V
    Operating Temperature : -40°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 16-SSOP (0.154", 3.90mm Width)
    Supplier Device Package : 16-SSOP

极速报价

型号
品牌 封装 批号 查看
MAX3222ECDW TI 20-SOIC New 详细
LM7705MMEVAL TI New 详细
LM2664M6 TI SOT-23-6 New 详细
MSP430F5631IZQWT TI 113-BGA Microstar Junior (7x7) New 详细
CD74HC4046AMG4 TI New 详细
TMS320C5535AZHH10 TI 144-BGA MICROSTAR (12x12) New 详细
DS125BR800AEVM TI New 详细
BQ27220YZFT TI 9-DSBGA New 详细
PTMA402050A1AD TI New 详细
SN74LVC1G08DCKRG4 TI SC-70-5 New 详细
BQ500211ARGZR TI 48-VQFN (7x7) New 详细
TLC2274AMDR TI 14-SOIC New 详细
OPA655U TI 8-SOIC New 详细
ISO7821LLSEVM TI New 详细
LM3S9DN6-IBZ80-A2 TI 108-BGA (10x10) New 详细
SN74AC244MNSREP TI 20-SO New 详细
OPA2347EA/250 TI SOT-23-8 New 详细
UCC3800D TI 8-SOIC New 详细
LMV822DG4 TI 8-SOIC New 详细
LM2596SX-3.3/NOPB TI DDPAK/TO-263-5 New 详细