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罗斌森
  • ISO7763FDBQ

  • Manufacturer : Texas Instruments
    Packaging : Tube
    Alternate Packaging
    Part Status : Active
    Technology : Capacitive Coupling
    Type : General Purpose
    Isolated Power : No
    Number of Channels : 6
    Inputs - Side 1/Side 2 : 3/3
    Channel Type : Unidirectional
    Voltage - Isolation : 3000Vrms
    Common Mode Transient Immunity (Min) : 85kV/μs
    Data Rate : 100Mbps
    Propagation Delay tpLH / tpHL (Max) : 16ns, 16ns
    Pulse Width Distortion (Max) : 4.9ns
    Rise / Fall Time (Typ) : 1.1ns, 1.4ns
    Voltage - Supply : 2.25V ~ 5.5V
    Operating Temperature : -55°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 16-SSOP (0.154", 3.90mm Width)
    Supplier Device Package : 16-SSOP

极速报价

型号
品牌 封装 批号 查看
TPS40210EVM TI New 详细
BQ24780SEVM-583 TI New 详细
LMH6550MAX TI 8-SOIC New 详细
BQ296112DSGT TI 8-WSON (2x2) New 详细
TPS2543RTER TI 16-WQFN (3x3) New 详细
TPS2062ADRBR TI 8-SON (3x3) New 详细
UCC28700EVM-068 TI New 详细
PCA9517DRG4 TI 8-SOIC New 详细
TPS2062CDGNR TI 8-MSOP-PowerPad New 详细
TCA8418EYFPR TI 25-DSBGA (2x2) New 详细
PCI1520IPDV TI 208-LQFP New 详细
TS3DV621RUAR TI 42-WQFN (3.5x9.0) New 详细
LP3990SD-1.2 TI 6-WSON (3x3) New 详细
ULN2003LVPWR TI 16-TSSOP New 详细
TMP302DDRLR TI 6-SOT New 详细
LM2902KNS TI 14-SOP New 详细
UC3827DW-1 TI 24-SOIC New 详细
DAC5311IDCKR TI SC-70-6 New 详细
LM26CIM5X-VPA TI SOT-23-5 New 详细
LM1086IS-3.3 TI DDPAK/TO-263-3 New 详细