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罗斌森
  • ISO7831FDW

  • Manufacturer : Texas Instruments
    Packaging : Bulk
    Part Status : Active
    Technology : Capacitive Coupling
    Type : General Purpose
    Isolated Power : No
    Number of Channels : 3
    Inputs - Side 1/Side 2 : 2/1
    Channel Type : Unidirectional
    Voltage - Isolation : 5700Vrms
    Common Mode Transient Immunity (Min) : 70kV/μs
    Data Rate : 100Mbps
    Propagation Delay tpLH / tpHL (Max) : 16ns, 16ns
    Pulse Width Distortion (Max) : 4.1ns
    Rise / Fall Time (Typ) : 1.7ns, 1.9ns
    Voltage - Supply : 2.25V ~ 5.5V
    Operating Temperature : -55°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 16-SOIC (0.295", 7.50mm Width)
    Supplier Device Package : 16-SOIC

极速报价

型号
品牌 封装 批号 查看
LM4879ITPX/NOPB TI 8-μSMD (1.36x1.36) New 详细
TLV2314IDGKT TI 8-VSSOP New 详细
ADC32RF82EVM TI New 详细
ADS774KPG4 TI 28-PDIP New 详细
SN74LVC2G07YZPR TI 6-DSBGA, 6-WCSP (1.4x0.9) New 详细
SN65LVDS32PW TI 16-TSSOP New 详细
LP2985AIM5X-5.7/NOPB TI SOT-23-5 New 详细
TLV71733PDQNT TI 4-X2SON (1x1) New 详细
PTH12060WAS TI New 详细
TLE2022ID TI 8-SOIC New 详细
CY74FCT2541ATSOCT TI 20-SOIC New 详细
SN74LVCC3245APWRE4 TI 24-TSSOP New 详细
LM4051AIM3-1.2/NOPB TI SOT-23-3 New 详细
CC1200DK TI New 详细
LM8342SDX/NOPB TI 10-WSON (3x3) New 详细
ADS1220IPW TI 16-TSSOP New 详细
MSP430G2211IPW14 TI 14-TSSOP New 详细
ULN2803ADW TI 18-SOIC New 详细
SN74LVC2G157YEPR TI 8-DSBGA, 8-WCSP (1.9x0.9) New 详细
BQ78350DBT-R1 TI 30-TSSOP New 详细