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ISO7831FDW
- Manufacturer : Texas Instruments
Packaging : Bulk
Part Status : Active
Technology : Capacitive Coupling
Type : General Purpose
Isolated Power : No
Number of Channels : 3
Inputs - Side 1/Side 2 : 2/1
Channel Type : Unidirectional
Voltage - Isolation : 5700Vrms
Common Mode Transient Immunity (Min) : 70kV/μs
Data Rate : 100Mbps
Propagation Delay tpLH / tpHL (Max) : 16ns, 16ns
Pulse Width Distortion (Max) : 4.1ns
Rise / Fall Time (Typ) : 1.7ns, 1.9ns
Voltage - Supply : 2.25V ~ 5.5V
Operating Temperature : -55°C ~ 125°C
Mounting Type : Surface Mount
Package / Case : 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package : 16-SOIC
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LMX2531LQ2820E/NOPB | TI | New | 详细 | ||
| LMH6739MQ/NOPB | TI | 16-SSOP | New | 详细 | |
| SN74LS221N | TI | 16-PDIP | New | 详细 | |
| REF2933AIDBZT | TI | SOT-23-3 | New | 详细 | |
| TLV2461AQDR | TI | 8-SOIC | New | 详细 | |
| LM2797MM-1.8/NOPB | TI | 10-VSSOP | New | 详细 | |
| UC3872N | TI | 14-PDIP | New | 详细 | |
| LP5900SD-1.5/NOPB | TI | 6-WSON (2.2x2.5) | New | 详细 | |
| DRV8350RHRGZT | TI | 48-VQFN (7x7) | New | 详细 | |
| SN74AUC1G126YEPR | TI | 5-DSBGA, 5-WCSP (1.4x0.9) | New | 详细 | |
| TPS62622YFFR | TI | 6-DSBGA | New | 详细 | |
| INA210-215EVM | TI | New | 详细 | ||
| CD74ACT297M | TI | 16-SOIC | New | 详细 | |
| TPS2047DR | TI | 16-SOIC | New | 详细 | |
| BQ24735EVM-710 | TI | New | 详细 | ||
| SRC4190IDBR | TI | 28-SSOP | New | 详细 | |
| SN74V273-10PZA | TI | 80-LQFP (14x14) | New | 详细 | |
| LM3480IM3-5.0 | TI | SOT-23-3 | New | 详细 | |
| TAS5612PHD | TI | 64-HTQFP (14x14) | New | 详细 | |
| CD74FCT541M | TI | 20-SOIC | New | 详细 |
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