罗斌森
  • DAC8552IDGKR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : microPOWER?
    Part Status : Active
    Number of Bits : 16
    Number of D/A Converters : 2
    Settling Time : 10μs
    Output Type : Voltage - Buffered
    Differential Output : No
    Data Interface : SPI, DSP
    Reference Type : External
    Voltage - Supply, Analog : 2.7V ~ 5.5V
    Voltage - Supply, Digital : 2.7V ~ 5.5V
    INL/DNL (LSB) : ±4, ±0.35
    Architecture : String DAC
    Operating Temperature : -40°C ~ 105°C
    Package / Case : 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
    Supplier Device Package : 8-VSSOP
    Mounting Type : Surface Mount

极速报价

型号
品牌 封装 批号 查看
COP8SGR728N8 TI 28-PDIP New 详细
LM4040D50IDBZR TI SOT-23-3 New 详细
ADS8318IBDRCR TI 10-VSON (3x3) New 详细
ADC101S051CIMF/NOPB TI SOT-23-6 New 详细
TMS320C6726RFPA225 TI 144-HTQFP (20x20) New 详细
DAC0808LCM TI 16-SOIC New 详细
SN74ALVCH162601GR TI 56-TSSOP New 详细
BQ4832YMA-85 TI 32-DIP Module (18.42x42.8) New 详细
PT6213P TI New 详细
LP38692MPX-ADJ TI SOT-223-5 New 详细
LM1086ILDX-3.3/NOPB TI 8-WSON (4x4) New 详细
LMC6494BEMX TI 14-SOIC New 详细
UCC283TDKTTT-3 TI DDPAK/TO-263-3 New 详细
LM4130BIM5-2.0 TI SOT-23-5 New 详细
LM2901QDRG4Q1 TI 14-SOIC New 详细
OPA2335AID TI 8-SOIC New 详细
LP2950ACZ-3.3/NOPB TI TO-92-3 New 详细
LM1085ISX-ADJ TI DDPAK/TO-263-3 New 详细
MSP430F2274IDAR TI 38-TSSOP New 详细
CC2431EMK TI New 详细