罗斌森
  • DAC8552IDGKT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : microPOWER?
    Part Status : Active
    Number of Bits : 16
    Number of D/A Converters : 2
    Settling Time : 10μs
    Output Type : Voltage - Buffered
    Differential Output : No
    Data Interface : SPI, DSP
    Reference Type : External
    Voltage - Supply, Analog : 2.7V ~ 5.5V
    Voltage - Supply, Digital : 2.7V ~ 5.5V
    INL/DNL (LSB) : ±4, ±0.35
    Architecture : String DAC
    Operating Temperature : -40°C ~ 105°C
    Package / Case : 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
    Supplier Device Package : 8-VSSOP
    Mounting Type : Surface Mount

极速报价

型号
品牌 封装 批号 查看
TPS73633DCQ TI SOT-223-6 New 详细
PC16550DV/NOPB TI 44-PLCC (16.58x16.58) New 详细
ADS1235IRHBT TI 32-VQFN (5x5) New 详细
LM2907M/NOPB TI 14-SOIC New 详细
SN74CBTLV3253DBQR TI 16-SSOP New 详细
LMC6772AIMM/NOPB TI 8-VSSOP New 详细
CD74HC574M96 TI New 详细
LM3S1621-IQC80-C3 TI 100-LQFP (14x14) New 详细
TMDSRSLVR TI New 详细
LM2426TE/NOPB TI TO-220-11 New 详细
OPA375IDCKR TI SC-70-5 New 详细
SN74LVC1G240DCKR TI SC-70-5 New 详细
74ALVCH162525GRG4 TI 56-TSSOP New 详细
PCI6620GHK TI 288-BGA Microstar (16x16) New 详细
LM4938MHX/NOPB TI 28-HTSSOP New 详细
SN74LVC3G17DCUR TI US8 New 详细
TLV1391CDBVRE4 TI SOT-23-5 New 详细
SN74ALS648ADWR TI 24-SOIC New 详细
LM386N-1 TI 8-PDIP New 详细
MSP430F6658IZQWT TI 113-BGA Microstar Junior (7x7) New 详细