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  • DAC8830MCDREP

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Discontinued at Digi-Key
    Operating Temperature : -55°C ~ 125°C
    Package / Case : 8-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 8-SOIC
    Mounting Type : Surface Mount

极速报价

型号
品牌 封装 批号 查看
LP38691SD-ADJ TI 6-WSON (3x3) New 详细
TLV2455IDR TI 16-SOIC New 详细
LM77CIMM-3/NOPB TI 8-VSSOP New 详细
TLV2404CNG4 TI 14-PDIP New 详细
SN74AS181ANTG4 TI 24-PDIP New 详细
SN74S32NSR TI 14-SOP New 详细
LM2576HVSX-3.3 TI DDPAK/TO-263-5 New 详细
SM74104SDX/NOPB TI 10-WSON (4x4) New 详细
OMAP3530ECUS TI 423-FCBGA (16x16) New 详细
TPS4H000BQPWPRQ1 TI 20-HTSSOP New 详细
LP8552TLE/NOPB TI 25-uSMD New 详细
TPS77516DR TI 8-SOIC New 详细
LM2512ASMX/NOPB TI 49-NFBGA (4x4) New 详细
SN74AS805BDW TI 20-SOIC New 详细
DCV010512P-U/700 TI New 详细
TUSB1002RGER TI 24-VQFN (4x4) New 详细
LM2748MTC/NOPB TI 14-TSSOP New 详细
TMS320DM6433ZWT6 TI 361-NFBGA (16x16) New 详细
SN74LVC1G34DCKRG4 TI SC-70-5 New 详细
SN74AS825ADWE4 TI New 详细