产品系列
CSD87330Q3D
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : NexFET?
Part Status : Active
FET Type : 2 N-Channel (Half Bridge)
FET Feature : Logic Level Gate
Drain to Source Voltage (Vdss) : 30V
Current - Continuous Drain (Id) @ 25°C : 20A
Vgs(th) (Max) @ Id : 2.1V @ 250μA
Gate Charge (Qg) (Max) @ Vgs : 5.8nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds : 900pF @ 15V
Power - Max : 6W
Operating Temperature : -55°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Package / Case : 8-PowerLDFN
Supplier Device Package : 8-LSON (3.3x3.3)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LM2675M-ADJ/NOPB | TI | 8-SOIC | New | 详细 | |
| TLV2463QDR | TI | 14-TSSOP | New | 详细 | |
| LP3923TL-VI/NOPB | TI | 30-TuSMD | New | 详细 | |
| USB2ANY | TI | New | 详细 | ||
| LM2672MX-ADJ/NOPB | TI | 8-SOIC | New | 详细 | |
| BQ24153AEVM-697 | TI | New | 详细 | ||
| SN74LV11APWT | TI | 14-TSSOP | New | 详细 | |
| TLV320AIC3007IRSBT | TI | 40-WQFN | New | 详细 | |
| UC2825QTRG3 | TI | 20-PLCC (9x9) | New | 详细 | |
| PCI1520GHK | TI | 209-PBGA (16x16) | New | 详细 | |
| LP5990TM-2.8EV | TI | New | 详细 | ||
| BQ24630RGET | TI | 24-VQFN (4x4) | New | 详细 | |
| SN75LP196DW | TI | 20-SOIC | New | 详细 | |
| LM2931S-5.0/NOPB | TI | DDPAK/TO-263-3 | New | 详细 | |
| THS6042CDDARG3 | TI | 8-SO PowerPad | New | 详细 | |
| LMS1585ACS-3.3/NOPB | TI | DDPAK/TO-263-3 | New | 详细 | |
| BQ40Z50EVM-561 | TI | New | 详细 | ||
| LM3S601-EQN50-C2T | TI | 48-LQFP (7x7) | New | 详细 | |
| LMV554MT/NOPB | TI | 14-TSSOP | New | 详细 | |
| SN74LVT240ANSR | TI | 20-SO | New | 详细 |
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