产品系列
CSD87330Q3D
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : NexFET?
Part Status : Active
FET Type : 2 N-Channel (Half Bridge)
FET Feature : Logic Level Gate
Drain to Source Voltage (Vdss) : 30V
Current - Continuous Drain (Id) @ 25°C : 20A
Vgs(th) (Max) @ Id : 2.1V @ 250μA
Gate Charge (Qg) (Max) @ Vgs : 5.8nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds : 900pF @ 15V
Power - Max : 6W
Operating Temperature : -55°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Package / Case : 8-PowerLDFN
Supplier Device Package : 8-LSON (3.3x3.3)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| INA111AU | TI | 16-SOIC | New | 详细 | |
| DRV8800RTYT | TI | 16-QFN (4x4) | New | 详细 | |
| TLV431BQDBZRQ1 | TI | SOT-23-3 | New | 详细 | |
| UCD9240RGCT | TI | 64-VQFN (9x9) | New | 详细 | |
| LM3812M-7.0/NOPB | TI | 8-SOIC | New | 详细 | |
| CD74HC563ME4 | TI | 20-SOIC | New | 详细 | |
| DRV8842PWPR | TI | 28-HTSSOP | New | 详细 | |
| SN74LVC2G32QDCURQ1 | TI | US8 | New | 详细 | |
| UCC27425QDRQ1 | TI | 8-SOIC | New | 详细 | |
| LM3S6610-EQC25-A2 | TI | 100-LQFP (14x14) | New | 详细 | |
| UCC2897RTJR | TI | 20-QFN (4x4) | New | 详细 | |
| DS15EA101SQE/NOPB | TI | 16-WQFN (4x4) | New | 详细 | |
| BQ4010MA-150 | TI | 28-DIP Module (18.42x37.72) | New | 详细 | |
| CD40147BPWE4 | TI | 16-TSSOP | New | 详细 | |
| LMD18200T/NOPB | TI | TO-220-11 | New | 详细 | |
| CD74HC4020E | TI | 16-PDIP | New | 详细 | |
| LM3150-250EVAL/NOPB | TI | New | 详细 | ||
| SN74AHC02DR | TI | 14-SOIC | New | 详细 | |
| TLC5940PWPR | TI | 28-HTSSOP | New | 详细 | |
| TLV571IPW | TI | 24-TSSOP | New | 详细 |
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