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  • CSD87330Q3D

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : NexFET?
    Part Status : Active
    FET Type : 2 N-Channel (Half Bridge)
    FET Feature : Logic Level Gate
    Drain to Source Voltage (Vdss) : 30V
    Current - Continuous Drain (Id) @ 25°C : 20A
    Vgs(th) (Max) @ Id : 2.1V @ 250μA
    Gate Charge (Qg) (Max) @ Vgs : 5.8nC @ 4.5V
    Input Capacitance (Ciss) (Max) @ Vds : 900pF @ 15V
    Power - Max : 6W
    Operating Temperature : -55°C ~ 150°C (TJ)
    Mounting Type : Surface Mount
    Package / Case : 8-PowerLDFN
    Supplier Device Package : 8-LSON (3.3x3.3)

极速报价

型号
品牌 封装 批号 查看
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XAM3359AZCZ TI 324-NFBGA(15x15) New 详细
SN74LVC1G34DCKRG4 TI SC-70-5 New 详细
LM385M TI 8-SOIC New 详细
LM3S5791-IQC80-C5T TI 100-LQFP (14x14) New 详细
SN74AHC14N TI 14-PDIP New 详细
SN74AS86ADR TI 14-SOIC New 详细
SN74V3660-7PEU TI 128-LQFP (14x20) New 详细
SN74ALS112AN TI New 详细
SN74LVC1G11DSFR TI 6-SON (1x1) New 详细
74ALVCH162525DLG4 TI 56-SSOP New 详细
TMS320F28035PNT TI 80-LQFP (12x12) New 详细
LM1247AAG/NA TI 24-DIP New 详细
CD74HC166M96 TI 16-SOIC New 详细
TAS3103DBTRG4 TI 38-TSSOP New 详细