产品系列
CSD87330Q3D
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : NexFET?
Part Status : Active
FET Type : 2 N-Channel (Half Bridge)
FET Feature : Logic Level Gate
Drain to Source Voltage (Vdss) : 30V
Current - Continuous Drain (Id) @ 25°C : 20A
Vgs(th) (Max) @ Id : 2.1V @ 250μA
Gate Charge (Qg) (Max) @ Vgs : 5.8nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds : 900pF @ 15V
Power - Max : 6W
Operating Temperature : -55°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Package / Case : 8-PowerLDFN
Supplier Device Package : 8-LSON (3.3x3.3)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LM95231CIMMX-2/NOPB | TI | 8-VSSOP | New | 详细 | |
| TLV2772AQDRG4 | TI | 8-SOIC | New | 详细 | |
| LMR10510YMFX/NOPB | TI | SOT-23-5 | New | 详细 | |
| TPS62133AQRGTTQ1 | TI | 16-VQFN (3x3) | New | 详细 | |
| SN74HC148DWRE4 | TI | 16-SOIC | New | 详细 | |
| SN74LS240DBR | TI | 20-SSOP | New | 详细 | |
| OPA843IDBVT | TI | SOT-23-5 | New | 详细 | |
| TPS5120QDBTRQ1G4 | TI | 30-TSSOP | New | 详细 | |
| SN65HVD253D | TI | 8-SOIC | New | 详细 | |
| LP5900SDX-2.0/NOPB | TI | 6-WSON (2.2x2.5) | New | 详细 | |
| TRSF3222ECDBRG4 | TI | 20-SSOP | New | 详细 | |
| UC3848DWG4 | TI | 16-SOIC | New | 详细 | |
| SN74GTLPH16612DL | TI | 56-SSOP | New | 详细 | |
| LMR62421XSDDEMO/NOPB | TI | New | 详细 | ||
| BQ24093DGQR | TI | 10-MSOP-PowerPad | New | 详细 | |
| MSP430FR2033IG48R | TI | 48-TSSOP | New | 详细 | |
| SN74AHCT74D | TI | New | 详细 | ||
| LM25575Q0MHX/NOPB | TI | 16-HTSSOP | New | 详细 | |
| LM4871MMX/NOPB | TI | 8-VSSOP | New | 详细 | |
| LM3S5Y36-IQR80-C1T | TI | 64-LQFP (10x10) | New | 详细 |
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