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罗斌森
  • DDC316CZXGR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Package / Case : 64-TFBGA
    Supplier Device Package : 64-NFBGA (8x8)
    Mounting Type : Surface Mount

极速报价

型号
品牌 封装 批号 查看
LM1851M/NOPB TI 8-SOIC New 详细
SN74LV595AQPWRQ1 TI 16-TSSOP New 详细
SN65LV1224BMDBREP TI 28-SSOP New 详细
MSP430F248TRGCR TI 64-VQFN (9x9) New 详细
ADS7891IPFBR TI 48-TQFP (7x7) New 详细
DAC811JU TI 28-SOIC New 详细
UCC28600DR TI 8-SOIC New 详细
LM95245CIM TI 8-SOIC New 详细
LMS1587CS-3.3 TI DDPAK/TO-263-3 New 详细
TPS62351DRCR TI 10-VSON (3x3) New 详细
TPS565201EVM-858 TI New 详细
OPA2325IDGKR TI 8-VSSOP New 详细
SN65HVD12P TI 8-PDIP New 详细
LM2852YMXAX-3.0 TI 14-HTSSOP New 详细
UCC3305NG4 TI 28-PDIP New 详细
LM2586S-12/NOPB TI DDPAK/TO-263-7 New 详细
DRV2605YZFT TI 9-DSBGA New 详细
OPA860ID TI 8-SOIC New 详细
CC2540EMK-USB TI New 详细
CD74HC125QPWRQ1 TI 14-TSSOP New 详细