产品系列

罗斌森

DIP-ADAPTER-EVM
Manufacturer : Texas Instruments
Part Status : Active
Proto Board Type : SMD to Plated Through Hole
Package Accepted : MSOP, SC70, SOIC, SOT23, SOT563, TSSOP
Number of Positions : 8

UCC2803QDREP	TI	8-SOIC	New	详细
型号	品牌	封装	批号	查看
TPS3897ADRYT	TI	6-SON (1.45x1)	New	详细
UCC28704EVM-724	TI		New	详细
LM22679QTJE-ADJ/NOPB	TI	TO-263-7 Thin	New	详细
RC4558DR	TI	8-SOIC	New	详细
TPS77518MPWPREP	TI	20-HTSSOP	New	详细
LM2587S-3.3	TI	DDPAK/TO-263-5	New	详细
CD74HC147NSRG4	TI	16-SO	New	详细
TPD4S012DRYR	TI	6-SON (1.45x1)	New	详细
TL3845DR	TI	14-SOIC	New	详细
LM3S5C31-IQC80-A1T	TI	100-LQFP (14x14)	New	详细
ADC121C021CIMK	TI	TSOT-23-6	New	详细
TLC085AIN	TI	16-PDIP	New	详细
OPA847IDBVR	TI	SOT-23-6	New	详细
LP2988AIMMX-5.0	TI	8-VSSOP	New	详细
TPS4H000BQPWPRQ1	TI	20-HTSSOP	New	详细
SN65HVD06D	TI	8-SOIC	New	详细
LM358DGKR	TI	8-VSSOP	New	详细
CD4020BNSR	TI	16-SO	New	详细
TMS320DM6431ZDU3	TI	376-BGA (23x23)	New	详细