产品系列
DS08MB200TSQ/NOPB
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Part Status : Active
Type : Buffer, Multiplexer
Applications : LVDS
Input : BLVDS, CML, LVDS, LVPECL
Output : LVDS
Data Rate (Max) : 800Mbps
Number of Channels : 4 x 1:2, 2:1
Delay Time : 1.0ns
Capacitance - Input : 3.5pF
Voltage - Supply : 3V ~ 3.6V
Current - Supply : 225mA
Operating Temperature : -40°C ~ 85°C
Mounting Type : Surface Mount
Package / Case : 48-WFQFN Exposed Pad
Supplier Device Package : 48-WQFN (7x7)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LM2585T-5.0/NOPB | TI | TO-220-5 | New | 详细 | |
| LM2662M | TI | 8-SOIC | New | 详细 | |
| TPS62229DDCT | TI | SOT-23-5 | New | 详细 | |
| LM4863LQX | TI | 24-WQFN (4x5) | New | 详细 | |
| SN74AHC1G14DRLR | TI | SOT-5 | New | 详细 | |
| ADS8688EVM-PDK | TI | New | 详细 | ||
| CD74HC75NSR | TI | 16-SO | New | 详细 | |
| PCI1410PGE | TI | 144-LQFP (20x20) | New | 详细 | |
| TPS7A7200RGWR | TI | 20-VQFN (5x5) | New | 详细 | |
| TLC27L4BIDR | TI | 14-SOIC | New | 详细 | |
| DCV012405P-U | TI | New | 详细 | ||
| LM3102MHX/NOPB | TI | 20-HTSSOP | New | 详细 | |
| LMS1587CS-3.3/NOPB | TI | DDPAK/TO-263-3 | New | 详细 | |
| SN74LVC1G27YZPR | TI | 6-DSBGA, 6-WCSP (1.4x0.9) | New | 详细 | |
| LM4841MT/NOPB | TI | 28-TSSOP | New | 详细 | |
| LM5001MAX | TI | 8-SOIC | New | 详细 | |
| TLC2552EVM | TI | New | 详细 | ||
| GD75232PW | TI | 20-TSSOP | New | 详细 | |
| LM46000AQPWPRQ1 | TI | 16-HTSSOP | New | 详细 | |
| SN74LVC1G07DSFR | TI | 6-SON (1x1) | New | 详细 |
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