产品系列

罗斌森
  • DS08MB200TSQ/NOPB

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Type : Buffer, Multiplexer
    Applications : LVDS
    Input : BLVDS, CML, LVDS, LVPECL
    Output : LVDS
    Data Rate (Max) : 800Mbps
    Number of Channels : 4 x 1:2, 2:1
    Delay Time : 1.0ns
    Capacitance - Input : 3.5pF
    Voltage - Supply : 3V ~ 3.6V
    Current - Supply : 225mA
    Operating Temperature : -40°C ~ 85°C
    Mounting Type : Surface Mount
    Package / Case : 48-WFQFN Exposed Pad
    Supplier Device Package : 48-WQFN (7x7)

极速报价

型号
品牌 封装 批号 查看
OPA2333AID TI 8-SOIC New 详细
SN74LV27APWR TI 14-TSSOP New 详细
TPS51163DRCT TI 10-VSON (3x3) New 详细
TPS3838K33MDBVREP TI SOT-23-5 New 详细
BQ24167YFFR TI 49-DSBGA (2.8x2.8) New 详细
SN74ALVCH16823DLR TI New 详细
TPS7A8018DRBR TI 8-SON (3x3) New 详细
ISO721DUBR TI 8-SOP New 详细
DS64BR401EVK/NOPB TI New 详细
SN74LS158NSR TI 16-SO New 详细
SN65MLVD206DR TI 8-SOIC New 详细
74LVCH16652ADLRG4 TI 56-SSOP New 详细
PCM1793DB TI 28-SSOP New 详细
TCAN330DCNR TI SOT-23-8 New 详细
TLV1117LV28DCYR TI SOT-223-4 New 详细
PCA9557DT TI 16-SOIC New 详细
LP3879SDX-1.0 TI 8-WSON (4x4) New 详细
TRF371135IRGZT TI 48-VQFN (7x7) New 详细
BQ20Z80ADBT-V110 TI 38-TSSOP New 详细
TLV2422AID TI 8-SOIC New 详细