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  • DS25BR100TSD/NOPB

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Type : Buffer, ReDriver
    Applications : LVDS
    Input : CML, LVDS, LVPECL
    Output : LVDS
    Data Rate (Max) : 3.125Gbps
    Number of Channels : 1
    Delay Time : 350ps
    Signal Conditioning : Input Equalization, Output Pre-Emphasis
    Capacitance - Input : 1.7pF
    Voltage - Supply : 3V ~ 3.6V
    Current - Supply : 35mA
    Operating Temperature : -40°C ~ 85°C
    Mounting Type : Surface Mount
    Package / Case : 8-WFDFN Exposed Pad
    Supplier Device Package : 8-WSON (3x3)

极速报价

型号
品牌 封装 批号 查看
UC3833N TI 8-PDIP New 详细
UCC27526DSDR TI 8-SON (3x3) New 详细
TLC2252QDRG4Q1 TI 8-SOIC New 详细
UCC3626PWTRG4 TI 28-TSSOP New 详细
CD74HC163E TI 16-PDIP New 详细
LM3S2B93-IQC80-C3T TI 100-LQFP (14x14) New 详细
TPS79433DCQG4 TI SOT-223-6 New 详细
ADS5483IRGCT TI 64-VQFN (9x9) New 详细
LMH7220MGX/NOPB TI SC-70-6 New 详细
REG103FA-2.7KTTTG3 TI DDPAK/TO-263-5 New 详细
LVDS001EVK TI New 详细
VSP2230Y/2K TI 48-LQFP (7x7) New 详细
SN65HVD3088EDGKR TI 8-VSSOP New 详细
TPS53314RGFR TI 40-VQFN-EP (5x7) New 详细
SN74V263-7GGM TI 100-BGA MICROSTAR (10.1x10.1) New 详细
TLV2376IDR TI 8-SOIC New 详细
LM20145EVAL TI New 详细
BQ25882YFFT TI 25-DSBGA (2.11x2.11) New 详细
UCD8220PWPRG4 TI 16-HTSSOP New 详细
TL1963A-33KTTR TI DDPAK/TO-263-5 New 详细