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  • DS25BR101TSDE/NOPB

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Type : Buffer, ReDriver
    Applications : LVDS
    Input : CML, LVDS, LVPECL
    Output : LVDS
    Data Rate (Max) : 3.125Gbps
    Number of Channels : 1
    Delay Time : 350ps
    Signal Conditioning : Input Equalization, Output Pre-Emphasis
    Capacitance - Input : 1.7pF
    Voltage - Supply : 3V ~ 3.6V
    Current - Supply : 35mA
    Operating Temperature : -40°C ~ 85°C
    Mounting Type : Surface Mount
    Package / Case : 8-WFDFN Exposed Pad
    Supplier Device Package : 8-WSON (3x3)

极速报价

型号
品牌 封装 批号 查看
PCA9534DGVR TI 16-TVSOP New 详细
SN74LVC06ARGYR TI 14-VQFN (3.5x3.5) New 详细
TLK10002CTR TI 144-FCBGA (13x13) New 详细
LP2951ACMM-3.0/NOPB TI 8-VSSOP New 详细
SN74AHCT14DR TI 14-SOIC New 详细
LM27402MH/NOPB TI 16-HTSSOP New 详细
SN74LS32NSR TI 14-SOP New 详细
LM5020MMX-2 TI 10-VSSOP New 详细
AMC1305L25QDWRQ1 TI 16-SOIC New 详细
BQ20Z70PW-V160 TI 20-TSSOP New 详细
TLV70218DBVR TI SOT-23-5 New 详细
78SR174SC TI New 详细
TPS2051BQDRQ1 TI 8-SOIC New 详细
SN74LVC1G07QDBVRQ1 TI SOT-23-5 New 详细
SN74LVC1G34YFPR TI 4-DSBGA (0.8x0.8) New 详细
BQ24192EVM-021 TI New 详细
SN74ALVC14D TI 14-SOIC New 详细
SN74F2373DBRE4 TI 20-SSOP New 详细
UCC27322QDRQ1 TI 8-SOIC New 详细
66AK2H12BAAW2 TI 1517-FCBGA (40x40) New 详细