产品系列

罗斌森
  • CSD88537ND

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : NexFET?
    Part Status : Active
    FET Type : 2 N-Channel (Dual)
    FET Feature : Standard
    Drain to Source Voltage (Vdss) : 60V
    Current - Continuous Drain (Id) @ 25°C : 15A
    Rds On (Max) @ Id, Vgs : 15 mOhm @ 8A, 10V
    Vgs(th) (Max) @ Id : 3.6V @ 250μA
    Gate Charge (Qg) (Max) @ Vgs : 18nC @ 10V
    Input Capacitance (Ciss) (Max) @ Vds : 1400pF @ 30V
    Power - Max : 2.1W
    Operating Temperature : -55°C ~ 150°C (TJ)
    Mounting Type : Surface Mount
    Package / Case : 8-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 8-SOIC

极速报价

型号
品牌 封装 批号 查看
TPS78228DRVT TI 6-SON (2x2) New 详细
TLE2021CP TI 8-PDIP New 详细
LM1085IS-3.3 TI DDPAK/TO-263-3 New 详细
TPS2032D TI 8-SOIC New 详细
LMC6044AIN/NOPB TI 14-DIP New 详细
DS96174CN TI New 详细
INA220AIDGSR TI 10-VSSOP New 详细
LM3674MF-ADJ TI SOT-23-5 New 详细
OPA196IDBVR TI SOT-23-5 New 详细
DAC8562SQDGSRQ1 TI 10-VSSOP New 详细
TPS65054RSMT TI 32-VQFN (4x4) New 详细
TS3A5018DR TI 16-SOIC New 详细
LP3971SQX-N510/NOPB TI 40-WQFN (5x5) New 详细
MSP432P401MIZXHT TI 80-NFBGA (5x5) New 详细
TL064INSR TI 14-SOP New 详细
UCC38085DRG4 TI 8-SOIC New 详细
TLV2254AQDR TI 14-SOIC New 详细
PCI2050IGHK TI 209-PBGA (16x16) New 详细
LP5552TL/NOPB TI 36-μSMD (3.46x3.46) New 详细
MSP430F168IRTDT TI 64-VQFN (9x9) New 详细