产品系列
FDC2212QDNTTQ1
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : Automotive, AEC-Q100
Part Status : Active
Type : Interface
Input Type : Capacitive
Output Type : I2C
Current - Supply : 2.1mA
Operating Temperature : -40°C ~ 125°C
Mounting Type : Surface Mount
Package / Case : 12-WFDFN Exposed Pad
Supplier Device Package : 12-WSON (4x4)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| SN74TVC16222ADGGR | TI | 48-TSSOP | New | 详细 | |
| THS4501CDGNR | TI | 8-MSOP-PowerPad | New | 详细 | |
| 78SR153VC | TI | New | 详细 | ||
| LM3S1D21-IBZ80-A2 | TI | 108-BGA (10x10) | New | 详细 | |
| LP3855ES-ADJ | TI | DDPAK/TO-263-5 | New | 详细 | |
| SN74LVTH16244AGRDR | TI | 54-BGA MICROSTAR JUNIOR (8.0x5.5) | New | 详细 | |
| TL064CD | TI | 14-SOIC | New | 详细 | |
| LM22677QTJ-5.0/NOPB | TI | TO-263-7 Thin | New | 详细 | |
| OPA551FAKTWT | TI | DDPAK/TO-263-7 | New | 详细 | |
| THS3110EVM | TI | New | 详细 | ||
| CC1021RSST | TI | New | 详细 | ||
| CY74FCT157ATDG4 | TI | 16-SOIC | New | 详细 | |
| TLV74115PDQNR | TI | 4-X2SON (1x1) | New | 详细 | |
| SN74LVC1G3208DCKT | TI | SC-70-6 | New | 详细 | |
| TPA2051D3YFFR | TI | 25-DSBGA | New | 详细 | |
| TPS65136EVM-265 | TI | New | 详细 | ||
| LP5551SQX/NOPB | TI | 36-WQFN (6x6) | New | 详细 | |
| TPS60402QDBVRQ1 | TI | SOT-23-5 | New | 详细 | |
| SN74LV174ADBRE4 | TI | New | 详细 | ||
| LPV358DRG4 | TI | 8-SOIC | New | 详细 |
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