罗斌森
  • HD3SS0001RLLR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Applications : Networking
    Multiplexer/Demultiplexer Circuit : 3:1, 2:1
    Number of Channels : 1
    On-State Resistance (Max) : 7.5 Ohm
    Voltage - Supply, Single (V+) : 3V ~ 3.6V
    -3db Bandwidth : 10GHz
    Operating Temperature : -40°C ~ 85°C (TA)
    Package / Case : 24-VFQFN Exposed Pad
    Supplier Device Package : 24-VQFN (3x3)

极速报价

型号
品牌 封装 批号 查看
BQ20Z70PW-V110G4 TI 20-TSSOP New 详细
SN74ALS574BN TI New 详细
LP3871ES-3.3/NOPB TI DDPAK/TO-263-5 New 详细
AMC1100DUB TI 8-SOP New 详细
LM2651-3.3EVAL TI New 详细
UCC3750DW TI 28-SOIC New 详细
SN74LVC374AQDWREP TI New 详细
LM3S1R26-IQR80-C5 TI 64-LQFP (10x10) New 详细
CDC203DWR TI 20-SOIC New 详细
TLV70230QDSERQ1 TI 6-WSON (1.5x1.5) New 详细
DAC101S101CIMM TI 8-VSSOP New 详细
LM2704MFX-ADJ TI SOT-23-5 New 详细
LM2831XMF/NOPB TI SOT-23-5 New 详细
TPS2384PAP TI 64-HTQFP (10x10) New 详细
TLV2625IDR TI 16-SOIC New 详细
LMP7712MMX TI 10-VSSOP New 详细
TL431BCDBVRG4 TI SOT-23-5 New 详细
SN75155D TI 8-SOIC New 详细
SN74ALS86D TI 14-SOIC New 详细
DAC082S085CIMMX/NOPB TI 10-VSSOP New 详细