罗斌森
  • HD3SS0001RLLR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Applications : Networking
    Multiplexer/Demultiplexer Circuit : 3:1, 2:1
    Number of Channels : 1
    On-State Resistance (Max) : 7.5 Ohm
    Voltage - Supply, Single (V+) : 3V ~ 3.6V
    -3db Bandwidth : 10GHz
    Operating Temperature : -40°C ~ 85°C (TA)
    Package / Case : 24-VFQFN Exposed Pad
    Supplier Device Package : 24-VQFN (3x3)

极速报价

型号
品牌 封装 批号 查看
TPS2551DBVRG4 TI SOT-23-6 New 详细
TPS7A6650HQDGNRQ1 TI 8-MSOP-PowerPad New 详细
INA300AIDGST TI New 详细
LM2673T-3.3/NOPB TI TO-220-7 New 详细
ADS6124IRHBT TI 32-VQFN (5x5) New 详细
TLV2473CDGQR TI 10-MSOP-PowerPad New 详细
LM3S1621-IQC80-C3 TI 100-LQFP (14x14) New 详细
LM2727MTCX TI 14-TSSOP New 详细
SN74CBT3245APW TI 20-TSSOP New 详细
LM5027ASQ/NOPB TI 24-WQFN (4x5) New 详细
LM2598SX-ADJ TI DDPAK/TO-263-7 New 详细
CC2630F128RHBT TI 32-VQFN (5x5) New 详细
CD74ACT273SM96 TI New 详细
DP83822HFRHBT TI 32-VQFN (5x5) New 详细
LMX2316SLBX/NOPB TI 16-CSP (3.5x3.5) New 详细
78ST109VC TI New 详细
UCC39412D TI 8-SOIC New 详细
TAS5121IDKD TI 36-HSSOP New 详细
TS3L100DR TI New 详细
TL103WIDR TI 8-SOIC New 详细