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ISO1176DW
- Manufacturer : Texas Instruments
Packaging : Tube
Alternate Packaging
Part Status : Active
Technology : Capacitive Coupling
Type : RS422, RS485
Isolated Power : No
Number of Channels : 3
Inputs - Side 1/Side 2 : 2/1
Channel Type : Unidirectional
Voltage - Isolation : 2500Vrms
Common Mode Transient Immunity (Min) : 25kV/μs
Data Rate : 40Mbps
Voltage - Supply : 3.15V ~ 5.5V, 4.75V ~ 5.25V
Operating Temperature : -40°C ~ 85°C
Mounting Type : Surface Mount
Package / Case : 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package : 16-SOIC
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LMR36015FSCQRNXTQ1 | TI | 12-VQFN-HR (3x2) | New | 详细 | |
| TPS62300DRCR | TI | 10-VSON (3x3) | New | 详细 | |
| MSP430F1222IRHBT | TI | 32-VQFN (5x5) | New | 详细 | |
| LM358BPX | TI | 8-microSMD | New | 详细 | |
| SN65HVD10QD | TI | 8-SOIC | New | 详细 | |
| BQ24032ARHLT | TI | 20-VQFN (3.5x4.5) | New | 详细 | |
| OPT3002EVM | TI | New | 详细 | ||
| LM2577N-15/NOPB | TI | 16-DIP | New | 详细 | |
| TLC2274CD | TI | 14-SOIC | New | 详细 | |
| TPS77050DBVR | TI | SOT-23-5 | New | 详细 | |
| SN74LVC1G02YEPR | TI | 5-DSBGA, 5-WCSP (1.4x0.9) | New | 详细 | |
| TMS32C6414EGLZA6E3 | TI | 532-FCBGA (23x23) | New | 详细 | |
| LMX2485SQ/NOPB | TI | 24-WQFN (4x4) | New | 详细 | |
| TPA0252PWP | TI | 24-HTSSOP | New | 详细 | |
| LM385BPW-2-5 | TI | 8-TSSOP | New | 详细 | |
| UCC3911DP-2G4 | TI | 16-SOIC | New | 详细 | |
| TLV2402QDGKRQ1 | TI | 8-VSSOP | New | 详细 | |
| SN74LVCU04ADGVR | TI | 14-TVSOP | New | 详细 | |
| TPS79918DRVR | TI | 6-WSON (2x2) | New | 详细 | |
| CD74HCT4020E | TI | 16-PDIP | New | 详细 |
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