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ISO7230CDW
- Manufacturer : Texas Instruments
Packaging : Tube
Alternate Packaging
Part Status : Active
Technology : Capacitive Coupling
Type : General Purpose
Isolated Power : No
Number of Channels : 3
Inputs - Side 1/Side 2 : 3/0
Channel Type : Unidirectional
Voltage - Isolation : 2500Vrms
Common Mode Transient Immunity (Min) : 25kV/μs
Data Rate : 25Mbps
Propagation Delay tpLH / tpHL (Max) : 42ns, 42ns
Pulse Width Distortion (Max) : 2.5ns
Rise / Fall Time (Typ) : 2ns, 2ns
Voltage - Supply : 3.15V ~ 5.5V
Operating Temperature : -40°C ~ 125°C
Mounting Type : Surface Mount
Package / Case : 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package : 16-SOIC
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| SN65LVDS315RGER | TI | 24-VQFN (4x4) | New | 详细 | |
| LM5160DNTJ | TI | 12-WSON (4x4) | New | 详细 | |
| UCC28083DR | TI | 8-SOIC | New | 详细 | |
| SN65HVD71D | TI | 8-SOIC | New | 详细 | |
| DAC6311IDCKT | TI | SC-70-6 | New | 详细 | |
| UCC35702N | TI | 14-PDIP | New | 详细 | |
| ADC34J43IRGZ25 | TI | 48-VQFN (7x7) | New | 详细 | |
| LM4128DMF-2.0 | TI | SOT-23-5 | New | 详细 | |
| TMDXEVM368 | TI | New | 详细 | ||
| LM2592HVS-3.3 | TI | DDPAK/TO-263-5 | New | 详细 | |
| X66AK2E05XABD25 | TI | 1089-FCBGA (27x27) | New | 详细 | |
| CY74FCT16244ATPVC | TI | 48-SSOP | New | 详细 | |
| UCC3837DG4 | TI | 8-SOIC | New | 详细 | |
| TLV272QDRQ1 | TI | 8-SOIC | New | 详细 | |
| LM3420M5-8.4 | TI | SOT-23-5 | New | 详细 | |
| LM2670SD-3.3 | TI | 14-VSON (5x6) | New | 详细 | |
| SN74BCT2414DW | TI | 20-SOIC | New | 详细 | |
| OMAP3525DCBB | TI | 515-POP-FCBGA (12x12) | New | 详细 | |
| ADS6423IRGCT | TI | 64-VQFN (9x9) | New | 详细 | |
| SN74HCT244QPWRG4Q1 | TI | 20-TSSOP | New | 详细 |
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