产品系列

罗斌森
  • ISO7320FCD

  • Manufacturer : Texas Instruments
    Packaging : Tube
    Alternate Packaging
    Part Status : Active
    Technology : Capacitive Coupling
    Type : General Purpose
    Isolated Power : No
    Number of Channels : 2
    Inputs - Side 1/Side 2 : 2/0
    Channel Type : Unidirectional
    Voltage - Isolation : 3000Vrms
    Common Mode Transient Immunity (Min) : 25kV/μs
    Data Rate : 25Mbps
    Propagation Delay tpLH / tpHL (Max) : 57ns, 57ns
    Pulse Width Distortion (Max) : 4ns
    Rise / Fall Time (Typ) : 2.4ns, 2.1ns
    Voltage - Supply : 3V ~ 5.5V
    Operating Temperature : -40°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 8-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 8-SOIC

极速报价

型号
品牌 封装 批号 查看
SN74ALVTH16821VR TI New 详细
ADS7890IPFBRG4 TI 48-TQFP (7x7) New 详细
LM3676SD-1.5 TI 8-WSON (3x3) New 详细
ADS7956QDBTRQ1 TI 38-TSSOP New 详细
SN74LVCR16245AZQLR TI 56-BGA MICROSTAR JUNIOR (7.0x4.5) New 详细
SN74AHC16540DGGR TI 48-TSSOP New 详细
SN74ALVCHR162245DL TI 48-SSOP New 详细
TPS60151EVM-359 TI New 详细
LM3S9U92-IQC80-A2 TI 100-LQFP (14x14) New 详细
SN74ALS1005N TI 14-PDIP New 详细
CDCF5801DBQ TI 24-SSOP/QSOP New 详细
LM15851NKE TI New 详细
SN74AHC245DW TI 20-SOIC New 详细
TMP468AIRGTR TI 16-VQFN (3x3) New 详细
UA78M05QKTPRQ1 TI 2-PowerFLEX? New 详细
SN74ALVC08RGYR TI 14-VQFN (3.5x3.5) New 详细
TPS75515KTTT TI DDPAK/TO-263-5 New 详细
LM3102MH/NOPB TI 20-HTSSOP New 详细
SN75LVDS9637DRG4 TI 8-SOIC New 详细
CD74AC623M96G4 TI 20-SOIC New 详细