产品系列
HPC36004V30/NOPB
- Manufacturer : Texas Instruments
Packaging : Tube
Series : HPC?
Part Status : Obsolete
Core Processor : HPC
Core Size : 16-Bit
Speed : 30MHz
Connectivity : EBI/EMI, Microwire/Plus (SPI), UPI, UART/USART
Peripherals : DMA, PWM, WDT
Number of I/O : 52
Program Memory Type : ROMless
RAM Size : 512 x 8
Voltage - Supply (Vcc/Vdd) : 4.5V ~ 5.5V
Oscillator Type : External
Operating Temperature : -40°C ~ 85°C (TA)
Mounting Type : Surface Mount
Package / Case : 68-LCC (J-Lead)
Supplier Device Package : 68-PLCC (25.13x25.13)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LM2676SX-ADJ/NOPB | TI | DDPAK/TO-263-7 | New | 详细 | |
| THS3202EVM | TI | New | 详细 | ||
| TPS77033DBVR | TI | SOT-23-5 | New | 详细 | |
| TPA6203A1EVM | TI | New | 详细 | ||
| UCC28517NG4 | TI | 20-PDIP | New | 详细 | |
| DS91D180TMA | TI | 14-SOIC | New | 详细 | |
| REG101UA-3.3 | TI | 8-SOIC | New | 详细 | |
| LP3872ET-3.3/NOPB | TI | TO-220-5 | New | 详细 | |
| LM2663M | TI | 8-SOIC | New | 详细 | |
| UCC28703DBVT | TI | SOT-23-6 | New | 详细 | |
| LM3S2793-IBZ80-C1 | TI | 108-BGA (10x10) | New | 详细 | |
| TLV70530YFMR | TI | 4-DSLGA | New | 详细 | |
| 74ACT16651DLR | TI | 56-SSOP | New | 详细 | |
| OPA2314AID | TI | 8-SOIC | New | 详细 | |
| LM3S301-EQN20-C2T | TI | 48-LQFP (7x7) | New | 详细 | |
| TL2575HV-05IKV | TI | TO-220-5 | New | 详细 | |
| LMR10520XSDX/NOPB | TI | 6-WSON (3x3) | New | 详细 | |
| TL431AQDBVRG4 | TI | SOT-23-5 | New | 详细 | |
| INA190A3IRSWT | TI | 10-UQFN (1.8x1.4) | New | 详细 | |
| SN75LVDS86ADGG | TI | 48-TSSOP | New | 详细 |
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