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罗斌森
  • ISO7641FMDWR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Technology : Capacitive Coupling
    Type : General Purpose
    Isolated Power : No
    Number of Channels : 4
    Inputs - Side 1/Side 2 : 3/1
    Channel Type : Unidirectional
    Voltage - Isolation : 4243Vrms
    Common Mode Transient Immunity (Min) : 25kV/μs
    Data Rate : 150Mbps
    Propagation Delay tpLH / tpHL (Max) : 10.5ns, 10.5ns
    Pulse Width Distortion (Max) : 2ns
    Rise / Fall Time (Typ) : 1.6ns, 1ns
    Voltage - Supply : 2.7V ~ 5.5V
    Operating Temperature : -40°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 16-SOIC (0.295", 7.50mm Width)
    Supplier Device Package : 16-SOIC

极速报价

型号
品牌 封装 批号 查看
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BQ24311DSGR TI 8-WSON (2x2) New 详细
LP5951MF-2.5/NOPB TI SOT-23-5 New 详细
CD74HC85PWT TI New 详细
DAC8831ICRGYR TI 14-VQFN (3.5x3.5) New 详细
CY29FCT520BTSOCTE4 TI 24-SOIC New 详细
SN74AHC594D TI 16-SOIC New 详细
TPS259573DSGR TI 8-WSON (2x2) New 详细
SN75LPE185DW TI 24-SOIC New 详细
LP3872ES-5.0/NOPB TI DDPAK/TO-263-5 New 详细
AM1806EZWT3 TI 361-NFBGA (16x16) New 详细
SN74ALS137AD TI 16-SOIC New 详细
BQ24610RGER TI 24-VQFN (4x4) New 详细
SN74AC245PW TI 20-TSSOP New 详细
PCI4515ZHK TI 257-BGA MICROSTAR (16x16) New 详细
LP3950SLX/NOPB TI 32-TLGA (4.5x5.5) New 详细
LP3986TLX-2518/NOPB TI 8-DSBGA (1.56x1.56) New 详细
TLV2462AMDREP TI 8-SOIC New 详细
TLV1117-18IKVURG3 TI TO-252-3 New 详细