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罗斌森
  • ISO7710DW

  • Manufacturer : Texas Instruments
    Packaging : Tube
    Alternate Packaging
    Part Status : Active
    Technology : Capacitive Coupling
    Type : General Purpose
    Isolated Power : No
    Number of Channels : 1
    Inputs - Side 1/Side 2 : 1/0
    Channel Type : Unidirectional
    Voltage - Isolation : 5000Vrms
    Common Mode Transient Immunity (Min) : 85kV/μs
    Data Rate : 100Mbps
    Propagation Delay tpLH / tpHL (Max) : 16ns, 16ns
    Pulse Width Distortion (Max) : 4.9ns
    Rise / Fall Time (Typ) : 1.8ns, 1.9ns
    Voltage - Supply : 2.25V ~ 5.5V
    Operating Temperature : -55°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 16-SOIC (0.295", 7.50mm Width)
    Supplier Device Package : 16-SOIC

极速报价

型号
品牌 封装 批号 查看
TPS62320YEDT TI 8-DSBGA (1.8x1.8) New 详细
SN74S124DRE4 TI 16-SOIC New 详细
UC3846DWTR TI 16-SOIC New 详细
LM95214CISDX TI 14-WSON (4x4) New 详细
SN74ALS870DWE4 TI 24-SOIC New 详细
LM3S6918-IBZ50-A2T TI 108-BGA (10x10) New 详细
SN75ALS163DWRG4 TI 20-SOIC New 详细
LM3677LE-1.5/NOPB TI 6-LLP (2.0x1.5) New 详细
TLE2142IP TI 8-PDIP New 详细
TLE2021CPWRG4 TI 8-TSSOP New 详细
LM3487QMMX/NOPB TI 10-VSSOP New 详细
BQ20Z75DBTR-V180 TI 38-TSSOP New 详细
TPS74201KTWT TI DDPAK/TO-263-7 New 详细
TMS320VC549PGER-80 TI 144-LQFP (20x20) New 详细
SN74LVTH573RGYR TI 20-VQFN (3.5x4.5) New 详细
TPS7A1650DRBR TI 8-SON (3x3) New 详细
REG103UA-2.5 TI 8-SOIC New 详细
MSP430FR5869IRGZT TI 48-VQFN (7x7) New 详细
CC2640R2FYFVR TI New 详细
LMV982MM/NOPB TI 10-VSSOP New 详细