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罗斌森
  • ISO7710FDR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Technology : Capacitive Coupling
    Type : General Purpose
    Isolated Power : No
    Number of Channels : 1
    Inputs - Side 1/Side 2 : 1/0
    Channel Type : Unidirectional
    Voltage - Isolation : 3000Vrms
    Common Mode Transient Immunity (Min) : 85kV/μs
    Data Rate : 100Mbps
    Propagation Delay tpLH / tpHL (Max) : 16ns, 16ns
    Pulse Width Distortion (Max) : 4.9ns
    Rise / Fall Time (Typ) : 1.8ns, 1.9ns
    Voltage - Supply : 2.25V ~ 5.5V
    Operating Temperature : -55°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 8-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 8-SOIC

极速报价

型号
品牌 封装 批号 查看
LM3S1811-IBZ50-C5 TI 108-BGA (10x10) New 详细
SN74LVC06ADR TI 14-SOIC New 详细
SN74AC245N TI 20-PDIP New 详细
LM4132BMFX-4.1 TI SOT-23-5 New 详细
74ALVCF162834LRG4 TI 56-SSOP New 详细
MSP-EXP430FR4133 TI New 详细
BQ24266RGER TI 24-VQFN (4x4) New 详细
BQ76940EVM TI New 详细
PCA9557RGYR TI 16-VQFN (4x4) New 详细
SN74LS670DRG4 TI 16-SOIC New 详细
LM3S1N11-IBZ50-C5 TI 108-BGA (10x10) New 详细
TL082CDRG4 TI 8-SOIC New 详细
SN74AHC74MDREP TI New 详细
LM4140ACM-2.5/NOPB TI 8-SOIC New 详细
LM2936QHBMA-5.0/NOPB TI 8-SOIC New 详细
LP2988AIMM-2.7 TI 8-VSSOP New 详细
LMV824MTX TI 14-TSSOP New 详细
SN74LVTH16373GRDR TI 54-BGA MICROSTAR JUNIOR (8.0x5.5) New 详细
TPS79330YZQT TI 5-DSBGA New 详细
SN74LVC1G386YEPR TI 6-DSBGA, 6-WCSP (1.4x0.9) New 详细