产品系列

罗斌森
  • ISO7721FDWR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Technology : Capacitive Coupling
    Type : General Purpose
    Isolated Power : No
    Number of Channels : 2
    Inputs - Side 1/Side 2 : 1/1
    Channel Type : Unidirectional
    Voltage - Isolation : 5000Vrms
    Common Mode Transient Immunity (Min) : 85kV/μs
    Data Rate : 100Mbps
    Propagation Delay tpLH / tpHL (Max) : 16ns, 16ns
    Pulse Width Distortion (Max) : 4.9ns
    Rise / Fall Time (Typ) : 1.8ns, 1.9ns
    Voltage - Supply : 2.25V ~ 5.5V
    Operating Temperature : -55°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 16-SOIC (0.295", 7.50mm Width)
    Supplier Device Package : 16-SOIC

极速报价

型号
品牌 封装 批号 查看
BQ27411DRZR-G1C TI 12-SON (2.5x4) New 详细
SN74AUC1G14DCKR TI SC-70-5 New 详细
TPS76833QPWPRQ1 TI 20-HTSSOP New 详细
XRM48L952ZWTT TI 337-NFBGA (16x16) New 详细
74ALVCH162268ZQLR TI 56-BGA MICROSTAR JUNIOR (7.0x4.5) New 详细
LP3875ESX-3.3/NOPB TI DDPAK/TO-263-5 New 详细
TPS65168RSBR TI 40-PWQFN (4.15x4.15) New 详细
TM4C123GH6PGEI7 TI 144-LQFP (20x20) New 详细
SN74AC563DWR TI 20-SOIC New 详细
PTN04050CAD TI New 详细
CDC421106RGETG4 TI 24-VQFN (4x4) New 详细
CD4086BM96G4 TI 14-SOIC New 详细
SN74CBTLV3126PWR TI 14-TSSOP New 详细
XIO2000AZHH TI 175-BGA MICROSTAR (12x12) New 详细
LF298M/NOPB TI 14-SOIC New 详细
SN74HC573ADBR TI 20-SSOP New 详细
LM3S9C97-IBZ80-A1T TI 108-BGA (10x10) New 详细
SN74LVC1G18YEPR TI 6-DSBGA, 6-WCSP (1.4x0.9) New 详细
SN74CBTLV3253DR TI 16-SOIC New 详细
MAX3232ECDR TI 16-SOIC New 详细