产品系列
ISO7741FDBQ
- Manufacturer : Texas Instruments
Packaging : Tube
Alternate Packaging
Part Status : Active
Technology : Capacitive Coupling
Type : General Purpose
Isolated Power : No
Number of Channels : 4
Inputs - Side 1/Side 2 : 3/1
Channel Type : Unidirectional
Voltage - Isolation : 2500Vrms
Common Mode Transient Immunity (Min) : 85kV/μs
Data Rate : 100Mbps
Propagation Delay tpLH / tpHL (Max) : 16ns, 16ns
Pulse Width Distortion (Max) : 4.9ns
Rise / Fall Time (Typ) : 2.4ns, 2.4ns
Voltage - Supply : 2.25V ~ 5.5V
Operating Temperature : -55°C ~ 125°C
Mounting Type : Surface Mount
Package / Case : 16-SSOP (0.154", 3.90mm Width)
Supplier Device Package : 16-SSOP
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| ADS1014IDGST | TI | 10-VSSOP | New | 详细 | |
| TL2842BDR | TI | 14-SOIC | New | 详细 | |
| LMZM23600SILT | TI | 10-uSIP (3.8x3) | New | 详细 | |
| SN74ABT162601DLR | TI | 56-SSOP | New | 详细 | |
| SN74AHC244NSR | TI | 20-SO | New | 详细 | |
| MAX3222CDW | TI | 20-SOIC | New | 详细 | |
| LMV931MGX | TI | SC-70-5 | New | 详细 | |
| LP3853ET-3.3 | TI | TO-220-5 | New | 详细 | |
| ADS5485IRGC25 | TI | 64-VQFN (9x9) | New | 详细 | |
| MSP430F2252IDA | TI | 38-TSSOP | New | 详细 | |
| SN74ALVC16834DLG4 | TI | 56-SSOP | New | 详细 | |
| TLV2217-33KVURG3 | TI | TO-252-3 | New | 详细 | |
| TPS2592ZADRCR | TI | 10-VSON (3x3) | New | 详细 | |
| TLV70212QDSERQ1 | TI | 6-WSON (1.5x1.5) | New | 详细 | |
| CD74AC573M | TI | 20-SOIC | New | 详细 | |
| SN65LVDS33MDREP | TI | 16-SOIC | New | 详细 | |
| DS90LV110TMTCX | TI | 28-TSSOP | New | 详细 | |
| REF5045AID | TI | 8-SOIC | New | 详细 | |
| BQ51013BEVM-764 | TI | New | 详细 | ||
| TPA2000D2PWP | TI | 24-HTSSOP | New | 详细 |
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