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罗斌森
  • ISO7763DW

  • Manufacturer : Texas Instruments
    Packaging : Tube
    Alternate Packaging
    Part Status : Active
    Technology : Capacitive Coupling
    Type : General Purpose
    Isolated Power : No
    Number of Channels : 6
    Inputs - Side 1/Side 2 : 3/3
    Channel Type : Unidirectional
    Voltage - Isolation : 5000Vrms
    Common Mode Transient Immunity (Min) : 85kV/μs
    Data Rate : 100Mbps
    Propagation Delay tpLH / tpHL (Max) : 16ns, 16ns
    Pulse Width Distortion (Max) : 4.9ns
    Rise / Fall Time (Typ) : 1.1ns, 1.4ns
    Voltage - Supply : 2.25V ~ 5.5V
    Operating Temperature : -55°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 16-SOIC (0.295", 7.50mm Width)
    Supplier Device Package : 16-SOIC

极速报价

型号
品牌 封装 批号 查看
SN74AUP2G126YFPR TI 8-DSBGA (1.6x0.8) New 详细
LMV112SD TI 8-WSON (3x3) New 详细
SN74ACT86DR TI 14-SOIC New 详细
TRF37B32IRTVR TI New 详细
CD4042BDWRG4 TI 16-SOIC New 详细
TPS3808G01DBVEVM TI New 详细
LP2967IMM-2528/NOPB TI 8-VSSOP New 详细
LP2985IBP-3.6 TI 5-μSMD (0.93x1.11) New 详细
TPS60122PWP TI 20-HTSSOP New 详细
LM336MX-5.0 TI 8-SOIC New 详细
LM3401EVAL/NOPB TI New 详细
CLC007BM/NOPB TI 8-SOIC New 详细
F280041PMS TI New 详细
SN74GTLP817PWR TI 24-TSSOP New 详细
TPS62000QDGSRQ1 TI 10-VSSOP New 详细
TRSF3223EIDBR TI 20-SSOP New 详细
UCC2813DTR-1 TI 8-SOIC New 详细
SN74CBTR16861DGVR TI 48-TVSOP New 详细
UCC3800D TI 8-SOIC New 详细
BQ25122YFPT TI 25-DSBGA (2.53x2.47) New 详细