罗斌森
  • CSD97376Q4M

  • Manufacturer : Texas Instruments
    Packaging : Tape & Reel (TR)
    Alternate Packaging
    Series : NexFET?
    Part Status : Not For New Designs
    Output Configuration : Half Bridge
    Applications : Synchronous Buck Converters
    Interface : PWM
    Load Type : Inductive
    Technology : Power MOSFET
    Current - Output / Channel : 20A
    Current - Peak Output : 45A
    Voltage - Supply : 4.5V ~ 5.5V
    Voltage - Load : 4.5V ~ 24V
    Operating Temperature : -40°C ~ 150°C (TJ)
    Features : Bootstrap Circuit
    Fault Protection : Shoot-Through, UVLO
    Mounting Type : Surface Mount
    Package / Case : 8-PowerVFDFN
    Supplier Device Package : 8-VSON (3.5x4.5)

极速报价

型号
品牌 封装 批号 查看
SN74V293-7PZA TI 80-LQFP (14x14) New 详细
LMK00338RTAR TI 40-WQFN (6x6) New 详细
TLC2274AMDREP TI 14-SOIC New 详细
LP395Z/NOPB TI TO-92-3 New 详细
LMP8672MA/NOPB TI 8-SOIC New 详细
LM4879ITP TI 8-μSMD (1.36x1.36) New 详细
DS14185WMX TI 20-SOIC New 详细
LM2574HVMX-ADJ TI 14-SOIC New 详细
TPS60500DGSR TI 10-VSSOP New 详细
LMH6523SQ/NOPB TI 54-WQFN (10x5.5) New 详细
TAS2521IRGET TI 24-VQFN (4x4) New 详细
TPPM0115DR TI 8-SOIC New 详细
CD4033BNSR TI 16-SO New 详细
DP83822IRHBT TI 32-VQFN (5x5) New 详细
LM48555TL/NOPB TI 12-μSMD (1.46x1.97) New 详细
UCC2580D-1 TI 16-SOIC New 详细
LMP7701MF TI SOT-23-5 New 详细
TPS65280RGER TI 24-VQFN (4x4) New 详细
CD4052BM96E4 TI 16-SOIC New 详细
TNETV2685FIDZUT9 TI 529-FCBGA (19x19) New 详细